Semiconductor device
View Patent ↗A nitride semiconductor device is disclosed. The semiconductor device includes a semiconductor stack with a top layer containing gallium (Ga) and nitrogen (N), electrodes of a source, a gate and a drain provided on the semiconductor stack, and a silicon nitride (SiN) film provided on the GaN layer between the drain electrode and the gate electrode but apart from the gate electrode. The SiN film has a silicon rich composition with a composition ratio of Si/N that is greater than 3/4 and substantial oxygen contents.
1. A nitride semiconductor device, comprising:
a substrate;
a semiconductor stack that provides a top layer including gallium (Ga) and nitrogen (N);
a gate electrode and a drain electrode each provided on the top layer of the semiconductor stack; and
a first insulating film made of silicon nitride (SiN) provided on the top layer of the semiconductor stack between the gate electrode and the drain electrode, the first insulating film being apart from the gate electrode;
wherein the first insulating film has composition with a composition ratio of silicon against nitrogen (Si/N) greater than 3/4, and
wherein the top layer of the semiconductor stack in a portion in contact with the first insulating film has an oxygen content greater than an oxygen content in layers of the semiconductor stack below the top layer.
2. The nitride semiconductor device according to claim 1 ,
wherein the top layer of the semiconductor stack is doped with silicon (Si).
3. The nitride semiconductor device according to claim 2 ,
further including a second insulating film that covers the gate electrode, the drain electrode, and the first insulating film between the gate electrode and the drain electrode,
wherein the second insulating film is made of silicon nitride (SiN) with a composition ratio of silicon against nitrogen (Si/N) that is smaller than the composition ratio of silicon against nitrogen (Si/N) of the first insulating film.
4. The nitride semiconductor device according to claim 3 ,
wherein the top layer of the semiconductor stack has another portion in direct contact with the second insulating film, the another portion of the top layer having a silicon (Si) concentration higher than an Si concentration of the portion of the top layer in contact with the first insulating film.
5. The nitride semiconductor device according to claim 3 ,
wherein the top layer is made of n-type GaN, and
wherein the top layer has another portion in direct contact with the second insulating film, the another portion of the top layer having an oxygen (O) content that is smaller than the oxygen content of the portion of the top layer in contact with the first insulating film.
6. The nitride semiconductor device according to claim 3 ,
further including a source electrode in a side opposite to the drain electrode with respect to the gate electrode,
wherein the top layer is made of n-type GaN, and
wherein the second insulating film covers the source electrode, the drain electrode, the gate electrode, and the top layer between the source electrode and the gate electrode, and between the gate electrode and the drain electrode.
7. The nitride semiconductor device according to claim 1 ,
wherein the top layer is made of n-type GaN, and
wherein the portion of the top layer in contact with the first insulating film includes a gallium oxide.
8. The nitride semiconductor device according to claim 1 ,
wherein the top layer is made of n-type GaN, and
wherein the first insulating film is in contact with the drain electrode.
9. The nitride semiconductor device according to claim 1 ,
wherein the semiconductor stack includes, from a side of the substrate, a buffer layer made of gallium nitride, an electron supplying layer made of at least one of n-type aluminum gallium nitride (AlGaN) and n-type indium aluminum nitride (InAlN), and the top layer, the top layer being made of n-type gallium nitride (GaN).