ENHANCED VIA FILL MATERIAL AND PROCESSING FOR DUAL DAMASCENE INTEGRATION
A process comprises insulating a porous low k substrate with an organic polymer coating where the polymer does not penetrate or substantially penetrate the pores of the substrate, e.g., pores having a pore diameter of about one nm to about 5 nm, thereby completely or substantially mitigating the potential for capacitance increase of the substrate. The substrate comprises porous microcircuit substrate materials with surface pores optionally opening into subsurface pores. The organic polymer has a molecular weight greater than about 5,000 to greater than about 10,000 and a glass transition temperature greater than about 200° C. up to about the processing temperature required for forming the imaging layer and antireflective layer in a microcircuit, e.g., greater than about 225° C. The invention includes production of a product by this process and an article of manufacture embodying these features.
1 - 8 . (canceled)
9 . A coated porous substrate article of manufacture having minimized capacitance comprising a coating of an organic polymer on said porous substrate, said polymer having a molecular weight of greater than about 5,000 to greater than about 10,000 and a glass transition temperature greater than the processing temperature required for forming an imaging layer and antireflective layer in a microcircuit, said porous substrate comprising a porous microcircuit substrate material with surface pores optionally opening into subsurface pores, said pores being substantially free of said polymer.
10 . The article of claim 9 wherein said polymer has a glass transition temperature greater than about 200° C. to about greater than about 225° C.
11 . The article of claim 9 wherein said porous microcircuit substrate material comprises silica.
12 . The article of claim 10 wherein said porous microcircuit substrate material comprises silica.
13 - 20 . (canceled)