Package with support structure
Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.
1. A packaged semiconductor device comprising:
a package body comprising a semiconductor die;
a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure;
a plurality of external connections attached to the plurality of contact pads; and
a support structure comprising an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.
2. The packaged semiconductor device of claim 1 , further comprising:
radio frequency (RF) absorber material that attaches the back side of the package body to the inner surface of the attachment portion, the RF absorber material having a first pressure sensitive adhesive layer that attaches to the inner surface of the attachment portion and a second pressure sensitive adhesive layer that attaches to the back side of the package body.
3. The packaged semiconductor device of claim 1 , wherein one or more of the plurality of contact pads are connected to radio frequency (RF) signal lines of the semiconductor die.
4. The packaged semiconductor device of claim 1 , further comprising:
solder attach material on a bottom surface of each of the two or more standing members.
5. The packaged semiconductor device of claim 1 , wherein
the plurality of external connections is configured to be attached to a plurality of landing pads of a printed circuit board (PCB), and
the two or more standing members of the support structure are configured to be attached to the PCB to provide mechanical support for the semiconductor die without underfill material between the semiconductor die and the PCB.
6. The packaged semiconductor device of claim 5 , wherein
before the packaged semiconductor device is attached to the PCB, a difference between a height measured from the inner surface of the attachment portion to a peak of the external connections and a height of the two or more standing members is less than 50 microns.
7. The packaged semiconductor device of claim 1 , wherein
the support structure further comprises landing members laterally extending from the two or more standing members.
8. The packaged semiconductor device of claim 7 , wherein
the landing members are configured to be riveted to a printed circuit board (PCB).
9. The packaged semiconductor device of claim 1 , wherein
the support structure further comprises one or more panels between the two or more standing members.
10. The packaged semiconductor device of claim 9 , further comprising:
radio frequency (RF) absorber material attached to an inner surface of the one or more panels.
11. The packaged semiconductor device of claim 1 , further comprising:
the support structure is a metal structure.
12. A method for fabricating a packaged semiconductor device, the method comprising:
forming a redistribution layer (RDL) structure on an active side of a semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure;
attaching a plurality of external connections to the plurality of contact pads; and
attaching the semiconductor die to a support structure comprising an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of a package body that includes the semiconductor die is attached to an inner surface of the attachment portion.
13. The method of claim 12 , wherein the attaching the semiconductor die to the support structure comprises:
utilizing a radio frequency (RF) absorber material to attach the back side of the package body to the inner surface of the attachment portion, wherein the RF absorber material has a first pressure sensitive adhesive layer that attaches to the inner surface of the attachment portion and a second pressure sensitive adhesive layer that attaches to the back side of the package body.
14. The method of claim 12 , wherein one or more of the plurality of contact pads are connected to radio frequency (RF) signal lines of the semiconductor die.
15. The method of claim 12 , further comprising:
attaching solder attach material to a bottom surface of each of the two or more standing members.
16. The method of claim 12 , wherein
the plurality of external connections is configured to be attached to a plurality of landing pads of a printed circuit board (PCB), and
the two or more standing members of the support structure are configured to be attached to the PCB to provide mechanical support for the semiconductor die without underfill material between the semiconductor die and the PCB.
17. The method of claim 12 , wherein
the support structure further comprises landing members laterally extending from the two or more standing members.
18. The method of claim 17 , wherein
the landing members are configured to be riveted to a printed circuit board (PCB).
19. The method of claim 12 , wherein
the support structure further comprises one or more panels between the two or more standing members.
20. The method of claim 19 , further comprising:
attaching radio frequency (RF) absorber material to an inner surface of the one or more panels.