Patent Assignment
Reel/Frame 068541/0903
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2024-09-10
Received: 2024-09-10
Pages: 16
Assignor
NXP USA, INC.
Executed: 2024-07-31
Assignee
CHIP PACKAGING TECHNOLOGIES, LLC
5830 GRANITE PARKWAY, SUITE #100-216, PLANO, TX, 75024, UNITED STATES
Covered Applications
(41)
NO-GEL PRESSURE SENSOR PACKAGE
App. No. 18/045,677
→
NO-GEL PRESSURE SENSOR PACKAGE
App. No. 16/744,577
→
INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE
App. No. 16/440,446
→
PACKAGE TO DIE CONNECTION SYSTEM AND METHOD THEREFOR
App. No. 16/142,623
→
LEAD FRAME FOR INTEGRATED CIRCUIT DEVICE HAVING J-LEADS AND GULL WING LEADS
App. No. 15/980,572
→
PACKAGE WITH SUPPORT STRUCTURE
App. No. 15/864,348
→
LEAD FRAME HAVING REDISTRIBUTION LAYER
App. No. 15/701,572
→
PRESSURE-SENSING INTEGRATED CIRCUIT DEVICE WITH DIAPHRAGM
App. No. 15/356,622
→
LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE
App. No. 14/887,304
→
INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE
App. No. 14/861,886
→
INTEGRATED CIRCUIT PACKAGE HAVING SIDE AND BOTTOM CONTACT PADS
App. No. 14/850,958
→
Matrix Lid Heatspreader for Flip Chip Package
App. No. 14/850,070
→
SEMICONDUCTOR DEVICE WITH HEAT-DISSIPATING LEAD FRAME
App. No. 14/843,967
→
LEAD FRAME WITH POWER AND GROUND BARS
App. No. 14/833,135
→
SEMICONDUCTOR DEVICE PACKAGE FOR DEBUGGING AND RELATED FABRICATION METHODS
App. No. 14/741,088
→
EXPOSED DIE POWER SEMICONDUCTOR DEVICE
App. No. 14/552,442
→
SEMICONDUCTOR DEVICE HAVING LEAD FRAME WITH NOTCHED INNER LEADS
App. No. 14/551,075
→
COMMON PIN FOR MULTI-DIE SEMICONDUCTOR PACKAGE
App. No. 14/459,337
→
SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
App. No. 14/459,331
→
Wire Bond Mold Lock Method and Structure
App. No. 14/335,366
→
POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFORE
App. No. 14/331,724
→
LEAD-FRAME CIRCUIT PACKAGE
App. No. 14/285,079
→
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
App. No. 14/219,011
→
PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA
App. No. 14/220,121
→
SEMICONDUCTOR DEVICE WITH COMBINED POWER AND GROUND RING STRUCTURE
App. No. 14/161,706
→
MULTI-DIE SENSOR DEVICE
App. No. 14/086,942
→
SENSOR DEVICE PACKAGES AND RELATED FABRICATION METHODS
App. No. 14/057,262
→
HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE
App. No. 14/029,779
→
SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
App. No. 13/681,437
→
MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE
App. No. 13/618,185
→
PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS
App. No. 13/550,627
→
POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFOR
App. No. 13/538,585
→
SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
App. No. 13/530,118
→
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
App. No. 13/441,448
→
METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT
App. No. 13/398,816
→
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
App. No. 13/293,119
→
METHOD OF ASSEMBLING SHIELDED INTEGRATED CIRCUIT DEVICE
App. No. 13/092,162
→
LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING
App. No. 12/813,903
→
Method of Improving Adhesion of Bond Pad Over Pad Metallization with a Neighboring Passivation Layer by Depositing a Palladium Layer
App. No. 12/705,021
→
LEAD-FRAME CIRCUIT PACKAGE
App. No. 11/816,038
→
LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING
App. No. 11/398,944
→