LEAD-FRAME CIRCUIT PACKAGE
A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device. In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.
1 . A lead-frame circuit package comprising:
a die; and
a substrate having a first side on which a first side of the die is attached and a second side providing electrical connections, the substrate for routing radio frequency signals to or from the die via the electrical connections, wherein the substrate comprises reactive components formed therein, the reactive components coupled, on the first side of the substrate, to the die and, on the second side of the substrate, to the electrical connections, the reactive components providing impedance matching for the routing of the radio frequency signals.
2 . The lead-frame circuit package of claim 1 wherein the die comprises an exposed pad located on a second side of the die opposite the first side of the die, the exposed pad having a power amplifier device attached thereon.
3 . The lead-frame circuit package of claim 2 wherein the die is grounded through the exposed pad.
4 . A lead-frame circuit package according to claim 1 wherein the substrate is a multi-layer substrate or high density integration substrate to support signal routing to the power amplifier device.
5 . A lead-frame circuit package according to claim 1 wherein the reactive components are arranged to provide electrical characteristics equivalent to one or more radio frequency inductive choke(s).
6 . A lead-frame circuit package according to claim 1 wherein the substrate is arranged to operably couple tracks to or from a lead-frame using wire-bonding.
7 . A lead-frame circuit package according to claim 1 wherein the substrate is one of: organic, Low temperature Co-fired Ceramic substrate, an integrated passive device.
8 . A lead-frame circuit package according to claim 1 wherein the lead-frame circuit package is one of: Quad Flat No-lead package, Thin Quad Flat Pack or Small Outline package.
9 . A lead-frame circuit package according to claim 1 wherein the substrate is arranged to support flipped or non-flipped dice and/or surface mount devices.
10 . A lead-frame circuit package according to claim 1 wherein the substrate is arranged to be used as a relay pad within a high impedance integrated power amplifier implementation.
11 . A wireless communication unit comprising a transmitter portion adapted to transmit radio frequency signal and/or a receiver portion adapted to receive radio frequency signals utilizing a lead-frame circuit package comprising:
a lead frame and a substrate located on a first side of the lead frame to route radio frequency signals to or from a power amplifier device, wherein the lead frame comprises an exposed pad located on the first side of the lead frame, the exposed pad having the power amplifier device thereon, the power amplifier device having a ground connection through to the lead-frame via a path that does not include the substrate.
12 . The wireless communication unit of claim 11 wherein the substrate is a multi-layer substrate or high density integration substrate to support signal routing to the power amplifier device.
13 . The wireless communication unit of claim 11 wherein the power amplifier device is grounded through the exposed pad.
14 . A wireless communication unit according to claim 11 wherein the substrate supports tracks arranged to provide electrical characteristics equivalent to one or more radio frequency inductive choke(s).
15 . A wireless communication unit according to claim 11 wherein the substrate is arranged to operably couple tracks to or from the lead-frame using wire-bonding.
16 . A wireless communication unit according to claim 11 wherein the substrate is one of: organic, Low temperature Co-fired Ceramic substrate, an integrated passive device.
17 . A wireless communication unit according to claim 11 wherein the lead-frame circuit package is one of: Quad Flat No-lead package, Thin Quad Flat Pack or Small Outline package.
18 . A wireless communication unit according to claim 11 wherein the substrate is arranged to support flipped or non-flipped dice and/or surface mount devices.
19 . A wireless communication unit according to claim 11 wherein the substrate is arranged to be used as a relay pad within a high impedance integrated power amplifier implementation.
20 . A lead-frame circuit package comprising:
a die; and
a multi-layer substrate comprising a plurality of thin dielectric layers, the multi-layer substrate having a first side on which a first side of the die is attached and a second side providing electrical connections, the multi-layer substrate for routing radio frequency signals to or from the die via the electrical connections, wherein the multi-layer substrate comprises high-Q components formed therein, the high-Q components coupled, on the first side of the multi-layer substrate, to the die and, on the second side of the multi-layer substrate, to the electrical connections, the high-Q components providing impedance matching for the routing of the radio frequency signals.