Power transistor with heat dissipation and method therefore
A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and electrically conductive legs, each of the legs attached to a respective one of the contact pads, and an encapsulating material formed around the substrate, the IC die, and a portion of the legs. A contact end of each of the legs is exposed, and one of the contact ends conducts a signal from a transistor in the IC die.
1. A device comprising:
a substrate;
an integrated circuit (IC) die attached to the substrate on one side;
a plurality of contact pads on an active side of the IC die;
a plurality of legs that are thermally and electrically conductive, each of the legs attached to a respective one of the contact pads; and
an encapsulating material formed around the substrate, the IC die, and a portion of the legs, wherein a top surface of each of the legs is exposed to form contact ends, the contact ends are separated from each other by one or more grooves, the encapsulating material is not formed in the one or more grooves, the top surface of each of the legs is coplanar with a top surface of the encapsulating material, and one of the contact ends conducts a signal from a transistor in the IC die.
2. The device of claim 1 further comprising:
another one of the contact ends is coupled between a power supply and the transistor in the IC die.
3. The device of claim 1 wherein:
the IC die is a power die.
4. The device of claim 1 further comprising:
the legs are attached to the contact pads using one of a group consisting of a conductive adhesive and a conductive bond.
5. The device of claim 1 further comprising:
a circuit board, wherein the contact ends are attached to bond pads of the circuit board.
6. The device of claim 5 wherein:
the contact ends are attached to the bond pads of the circuit board using one of a group consisting of a conductive adhesive, solder, and an electrically and thermally conductive material.
7. The device of claim 1 wherein:
each contact end of the legs has an exposed surface area that is between 50 and 100 percent of a contact area of the corresponding bond pads.
8. A device comprising:
a leadframe;
an integrated circuit (IC) die attached to the leadframe;
a plurality of contact pads on an active side of the IC die;
a plurality of legs that are thermally and electrically conductive, each of the legs attached to a respective one of the contact pads; and
an encapsulating material formed around the leadframe, the IC die, and a portion of the legs, wherein a top surface of each of the legs is exposed to form contact ends, the contact ends are separated from each other by one or more grooves, the encapsulating material is not formed in the one or more grooves, the top surface of each of the legs is coplanar with a top surface of the encapsulating material, and one of the contact ends conducts a signal from a transistor in the IC die.
9. The device of claim 8 further comprising:
a control die attached to the leadframe, wherein the control die and the IC die are connected by a wire bond.
10. The device of claim 8 further comprising:
another one of the contact ends is coupled between a power supply and the transistor in the IC die.
11. The device of claim 8 wherein:
the IC die is a power die.
12. The device of claim 8 further comprising:
the legs are attached to the contact pads using one of a group consisting of a conductive adhesive and a conductive bond.
13. The device of claim 8 further comprising:
a circuit board, wherein the contact ends are attached to bond pads of the circuit board.
14. The device of claim 13 wherein:
the contact ends are attached to the bond pads of the circuit board using one of a group consisting of a conductive adhesive, solder, and an electrically and thermally conductive material.
15. The device of claim 8 wherein:
each contact end of the legs has an exposed surface area that is between 50 and 100 percent of a contact area of the corresponding bond pads.