IP Library Granted Patent US 10,934,622
Granted Patent B2
US 10,934,622 · App. 15/866,120 · Granted Mar 2, 2021

Substrate processing apparatus

Inventors: Teruo Yoshino (Toyama, JP); Naofumi Ohashi (Toyama, JP); Tadashi Takasaki (Toyama, JP); Shun Matsui (Toyama, JP)
Assignee: KOKUSAI ELECTRIC CORPORATION
C23C16/481C23C16/345C23C16/402C23C16/4584C23C16/4586C23C16/45523C23C16/46C23C16/50H01L21/67103H01L21/67109H01L21/67161H01L21/67248H01L21/68764H01L21/68771H01L21/68785H01L21/68742
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Quick Facts
Patent No.
US 10,934,622
App. No.
15/866,120
Granted
Mar 2, 2021
Kind
B2
Abstract

A substrate processing apparatus includes a heat storage part on which a substrate is mounted, a tray including the heat storage part, a substrate transfer part including a rotary shaft and a rotating plate supported by the rotary shaft and being configured such that the tray can be mounted on the rotating plate, a plurality of bases arranged circumferentially around the rotary shaft; and a heater provided for each of the bases.

Claims (27)

1. A substrate processing apparatus comprising:

a rotary shaft;

a rotating plate supported by the rotary shaft;

a plurality of bases arranged circumferentially around the rotary shaft;

a plasma generating part including a high frequency power supply and a high frequency power supply line, and configured to generate plasma above the bases;

a tray including:

a substrate mounting surface on which a substrate is mounted;

a neutralizing electrode disposed inside the tray such that the tray covers the neutralizing electrode so as not to expose the neutralizing electrode to the plasma when the tray is placed on the rotating plate;

an empty space disposed between an upper portion of the tray and the neutralizing electrode; and

a terminal;

a heater provided for each of the bases; and

a switch having one side electrically connected to the rotating plate and the other side connected to a ground,

wherein the terminal electrically connects the neutralizing electrode and the rotating plate when the tray is placed on the rotating plate.

2. The substrate processing apparatus of claim 1 , wherein the terminal is arranged on an outer side of a diameter of the substrate in a horizontal direction.

3. The substrate processing apparatus of claim 2 , wherein the switch is turned off while the plasma generating part generates the plasma, and is turned on after the plasma generating part stops the plasma generation until the tray is separated from the rotating plate.

4. The substrate processing apparatus of claim 2 , wherein, when the tray is mounted on the rotating plate, a hole through which the terminal passes is blocked by the rotating plate.

5. The substrate processing apparatus of claim 2 , further comprising a plurality of lift pins configured to lift the substrate,

wherein the rotating plate is configured to lift the tray, and

wherein, when the substrate is unloaded from the tray, the plurality of lift pins and the rotating plate are controlled to separate the substrate from the tray.

6. The substrate processing apparatus of claim 1 , wherein, when the tray is mounted on the rotating plate, a hole through which the terminal passes is blocked by the rotating plate.

7. The substrate processing apparatus of claim 1 , wherein the switch is turned off while the plasma generating part generates the plasma, and is turned on after the plasma generating part stops the plasma generation and until the tray is separated from the rotating plate.

8. The substrate processing apparatus of claim 7 , further comprising a plurality of lift pins configured to lift the substrate,

wherein the rotating plate is configured to lift the tray, and

wherein, when the substrate is unloaded from the tray, the plurality of lift pins and the rotating plate are controlled to separate the substrate from the tray.

9. The substrate processing apparatus of claim 1 , further comprising a plurality of lift pins configured to lift the substrate,

wherein the rotating plate is configured to lift the tray, and

wherein, when the substrate is unloaded from the tray, the plurality of lift pins and the rotating plate are controlled to separate the substrate from the tray.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047875/0251 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2018
From: YOSHINO, TERUO; OHASHI, NAOFUMI; TAKASAKI, TADASHI; MATSUI, SHUN
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 044600/0156 →
Priority Claims (1)
JP JP2017-179783 · Sep 20, 2017 · national
Continuity (1)
Related Publication 20190085455A1 · Mar 21, 2019
Cited By (1)
US 12,424,409