IP Library Assignment 047875/0251
Patent Assignment
Reel/Frame 047875/0251

Assignment of Assignor's Interest

Recorded: 2018-12-31 Pages: 5
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2018-12-05
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Properties (18)
Substrate Processing System
Application: 15/706,871 →
Publication: US 2019/0025799
Substrate Processing Apparatus
Application: 15/866,120 →
Publication: US 2019/0085455
Method of Manufacturing Semiconductor Device
Application: 15/881,249 →
Publication: US 2019/0081014
Method of Manufacturing Semiconductor Device
Application: 15/903,947 →
Method of Manufacturing Semiconductor Device
Application: 15/927,476 →
Publication: US 2019/0242015
Method of Manufacturing Semiconductor Device
Application: 15/940,618 →
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Application: 15/982,804 →
Publication: US 2018/0337031
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Application: 15/989,657 →
Publication: US 2018/0347047
Substrate Processing Apparatus and Substrate Retainer
Application: 16/034,959 →
Publication: US 2019/0024232
Substrate Processing Apparatus, and Thermocouple
Application: 16/046,682 →
Publication: US 2018/0328790
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Non-Transitory Computer-Readable Recording Medium
Application: 16/103,611 →
Publication: US 2019/0006218
Gas Supply Nozzle, Substrate Processing Apparatus, and Non-Transitory Computer-Readable Recording Medium
Application: 16/109,417 →
Publication: US 2018/0363137
Power Generation System, Management Device, and Semiconductor Manufacturing Apparatus
Application: 16/111,505 →
Publication: US 2019/0003342
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Application: 16/115,179 →
Publication: US 2018/0363138
Substrate Processing Apparatus and Furnace Opening Cover
Application: 16/136,496 →
Publication: US 2019/0017168
Substrate Processing Apparatus, Non-Transitory Computer-Readable Recording Medium Thereof and Semiconductor Manufacturing Method by Employing Thereof
Application: 16/139,784 →
Publication: US 2019/0024231
Substrate Processing Apparatus Having Gas Guide Capable of Suppressing Gas Diffusion
Application: 16/141,563 →
Publication: US 2019/0032213
Method of Manufacturing a Semiconductor Device
Application: 16/144,723 →
Publication: US 2019/0221460
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2017
From: NAKAYAMA, MASANORI; KAMAKURA, TSUKASA
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 043615/0271 →
Assignment of Assignor's Interest Jan 11, 2018
From: YOSHINO, TERUO; OHASHI, NAOFUMI; TAKASAKI, TADASHI; MATSUI, SHUN
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 044600/0156 →
Assignment of Assignor's Interest Jan 26, 2018
From: ITATANI, HIDEHARU; OHASHI, NAOFUMI; KIKUCHI, TOSHIYUKI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 044743/0226 →
Assignment of Assignor's Interest Feb 26, 2018
From: KAMAKURA, TSUKASA; ASAI, KAZUHIDE
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 045032/0628 →
Assignment of Assignor's Interest Mar 28, 2018
From: OHASHI, NAOFUMI; MATSUI, SHUN
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 045378/0348 →
Assignment of Assignor's Interest Mar 30, 2018
From: KAMAKURA, TSUKASA
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 045400/0166 →
Assignment of Assignor's Interest May 18, 2018
From: HASHIMOTO, YOSHITOMO; NAKAYAMA, MASANORI; NAGATO, MASAYA; MATSUOKA, TATSURU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 045845/0367 →
Assignment of Assignor's Interest May 29, 2018
From: HASHIMOTO, YOSHITOMO; MATSUOKA, TATSURU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 045925/0260 →
Assignment of Assignor's Interest Jul 31, 2018
From: OSAKA, AKIHIRO; KOSUGI, TETSUYA; AKAO, TOKUNOBU; UMEKAWA, ATSUSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 046511/0374 →
Assignment of Assignor's Interest Aug 24, 2018
From: YAMAMINE, NAOTOSHI; ISHIZU, HIDEO
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 046696/0226 →
Assignment of Assignor's Interest Aug 27, 2018
From: TOYODA, KAZUYUKI; YUASA, KAZUHIRO; YAMAMOTO, TETSUO
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 046706/0767 →
Assignment of Assignor's Interest Sep 11, 2018
From: NAKATANI, KIMIHIKO; KAMAKURA, TSUKASA; KARASAWA, HAJIME; HARADA, KAZUHIRO
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 046842/0990 →
Assignment of Assignor's Interest Sep 11, 2018
From: KOSUGI, TETSUYA; MURATA, HITOSHI; NOHARA, SHINGO; HIRANO, ATSUSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 046842/0221 →
Assignment of Assignor's Interest Nov 14, 2018
From: TAKAGI, KOSUKE; SASAJIMA, RYOTA; KOGURA, SHINTARO; AKAE, NAONORI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 047498/0589 →
Assignment of Assignor's Interest Nov 19, 2018
From: TAKAGI, KOSUKE; MORITA, SHINYA; AKAE, NAONORI; YAMAZAKI, KEISHIN
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 047547/0873 →
Assignment of Assignor's Interest Nov 19, 2018
From: SANO, ATSUSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 047548/0151 →
Assignment of Assignor's Interest Nov 20, 2018
From: YAHATA, TAKASHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 047557/0348 →
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →