Substrate processing apparatus, non-transitory computer-readable recording medium thereof and semiconductor manufacturing method by employing thereof
Embodiments of the invention relate to a substrate processing apparatus. In one embodiment, a substrate processing apparatus includes a plurality of process units. The process unit includes a process chamber for processing a substrate, an exhaust conduit connected to the process chamber and an exhaust pump arranged in the path of the exhaust conduit. The substrate processing apparatus further includes a connecting conduit connected to the exhaust conduits of the process units in the upstream of the exhaust pump and a switching unit which switches an exhaust path of the process chamber to the other exhaust pump in the other process unit via the connecting conduit.
1. A substrate processing apparatus comprising:
a first process unit including:
a first process chamber for processing a substrate,
a first exhaust path connected to at least the first process chamber, the first exhaust path including a first pump and a first auxiliary pump, the first pump and the first auxiliary pump being arranged sequentially from an upstream side in the first exhaust path, and
a first sensor, connected to the first pump, configured to monitor a condition of the first pump;
a second process unit including:
a second process chamber for processing a substrate,
a second exhaust path connected to at least the second process chamber, the second exhaust path including a second pump and a second auxiliary pump, the second pump and the second auxiliary pump being arranged sequentially from an upstream side in the second exhaust path, and
a second sensor, connected to the second pump, configured to monitor a condition of the second pump;
a switching system, having a path connecting between a first point upstream of the first pump in the first exhaust path and a second point upstream of the second pump in the second exhaust path, the path including a connecting valve disposed between the first point and the second point; and
a controller connected to the first sensor, the second sensor, and the connecting valve, the controller configured to:
get the condition of the first or second pump, respectively from the first or second sensor,
determine whether at least one of the first pump or the second pump is an abnormal state by comparing the condition with a condition of the stationary state and
provide an indication of an abnormality of at least one of the first pump and the second pump,
wherein the first pump is configured to pump the first process chamber to a high vacuum and the first auxiliary pump is configured to pump the first process chamber from a low rough vacuum to an atmospheric pressure in a stationary state, and the second pump is configured to pump the second process chamber to a high vacuum and the second auxiliary pump is configured to pump the second process chamber from a low rough vacuum to an atmospheric pressure in a stationary state.
2. The substrate processing apparatus according to claim 1 ,
wherein the first sensor is configured to monitor a first pressure as the condition of the first pump and the second sensor is configured to monitor a second pressure as the condition of the second pump and
the controller is configured to determine whether at least one of the first pump and the second pump is in an abnormal state by comparing the first pressure with a pressure of a stationary state and comparing the second pressure with the pressure of a stationary state, respectively.
3. The substrate processing apparatus according to claim 2 , wherein the controller is further configured to:
receive an indication to switch between the first exhaust path and the second exhaust path, and
control the connecting valve to switch between the first exhaust path and the second exhaust path in response to the indication.
4. The substrate processing apparatus according to claim 3 , wherein the switching system is further comprising:
a first valve, disposed in the first exhaust path downstream of the first point, and upstream of the first pump; and
a second valve, disposed in the second exhaust path downstream of the second point, and upstream of the second pump.
5. The substrate processing apparatus according to claim 4 , wherein the controller is further configured to control the switching system to:
close the first valve when the first exhaust path is determined as being in the abnormal state and close the second valve when the second exhaust path is determined as being in the abnormal state, and
open the connecting valve.
6. The substrate processing apparatus according to claim 1 , wherein the first pump is disposed downstream of a first valve, and the second pump is disposed downstream of a second valve.
7. The substrate processing apparatus according to claim 6 ,
wherein the first sensor is configured to monitor at least one of a number of revolutions, watt consumption and a temperature of the first exhaust pump and the second sensor is configured to monitor at least one of the number of revolutions, watt consumption, and a temperature of the second exhaust pump, and
the controller further is configured to determine whether at least one of the first exhaust path and the second exhaust path is in the abnormal state by comparing:
the at least one of the number of the revolution, watt consumption, the temperature of the first exhaust pump with one of a number of revolutions, watt consumption, the temperature of the first exhaust pump at the stationary state; and
the at least one of the number of the revolution, watt consumption and the temperature of the second exhaust pump with one of the number of revolutions, watt consumption, and the temperature of the second exhaust pump at the stationary state.
8. The substrate processing apparatus according to claim 7 , wherein the controller further configured to:
receive an indication to switch between the first exhaust path and the second exhaust path, and
control the switching system to switch between the first exhaust path and the second exhaust path in response to the indication.
9. The substrate processing apparatus according to claim 8 , wherein the controller is further configured to control the switching system to: close the first valve when the first exhaust path is determined as being in the abnormal state and close the second valve when the second exhaust path is determined as being in the abnormal state, and open the connecting valve.
10. The substrate processing apparatus according to claim 1 ,
wherein the first sensor is configured to detect at least one of a number of revolutions, watt consumption, and a temperature of the second exhaust pump and the second sensor is configured to detect at least one of a number of revolutions, watt consumption, and a temperature of the second exhaust pump.