Substrate processing apparatus, method of manufacturing semiconductor device, and non- transitory computer-readable recording medium
A substrate processing technique includes: a first heating device configured to heat a substrate to a first processing temperature; a first process chamber provided with the first heating device; a second heating device configured to heat the substrate to a second processing temperature utilizing microwaves, the second processing temperature being higher than the first processing temperature; a second process chamber provided with the second heating device; a substrate placement portion configured to load and unload the substrate with respect to the first process chamber and the second process chamber by placing and rotating the substrate; and a controller configured to respectively control the first heating device, the second heating device, and the substrate placement portion.
1. A substrate processing apparatus comprising:
a first heating device configured to heat a substrate to a first processing temperature;
a first process chamber provided with the first heating device;
a second heating device configured to heat the substrate to a second processing temperature utilizing microwaves, the second processing temperature being higher than the first processing temperature;
a second process chamber provided with the second heating device;
a substrate placement portion configured to load and unload the substrate with respect to the first process chamber and the second process chamber by placing and rotating the substrate; and
a controller configured to respectively control the first heating device, the second heating device, and the substrate placement portion;
wherein the substrate placement portion is made of a microwave transmitting material that transmits microwaves supplied from the second heating device.
2. The substrate processing apparatus according to claim 1 , wherein each of the first process chamber and the second process chamber is provided in plural.
3. The substrate processing apparatus according to claim 1 , wherein the substrate is alternately loaded into the first process chamber and the second process chamber and processed therein.
4. The substrate processing apparatus according to claim 1 , wherein the substrate placement portion comprises:
a first substrate support pin configured to support the substrate;
a plurality of ring connected to the first substrate support pin and having a diameter larger than an outer diameter of the substrate; and
an arm connected to the plurality of ring and bonding the plurality of ring to each other.
5. The substrate processing apparatus according to claim 1 , wherein the controller is configured to control the second heating device such that the second processing temperature becomes a temperature range in which a change in carrier density of the substrate is small.
6. The substrate processing apparatus according to claim 1 , wherein the controller is configured to control the first heating device and the second heating device such that the first processing temperature is 100° C. to 450° C. and the second processing temperature is 300° C. to 700° C.
7. The substrate processing apparatus according to claim 1 , wherein a substrate rotating unit configured to rotate the substrate is provided in the second process chamber.
8. The substrate processing apparatus according to claim 2 , wherein the first process chamber and the second process chamber are alternately disposed.
9. The substrate processing apparatus according to claim 2 , wherein the first process chamber and the second process chamber are disposed in parallel with each other.