IP Library Assignment 046706/0767
Patent Assignment
Reel/Frame 046706/0767

Assignment of Assignor's Interest

Recorded: 2018-08-27 Pages: 10
Assignors
TOYODA, KAZUYUKI
Executed: 2018-07-03
YUASA, KAZUHIRO
Executed: 2018-07-02
YAMAMOTO, TETSUO
Executed: 2018-07-02
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 105-0045, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Non-Transitory Computer-Readable Recording Medium
Application: 16/103,611 →
Publication: US 2019/0006218
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047875/0251 →