Semiconductor device

1. A semiconductor device comprising:

a plurality of gate electrodes stacked on an upper surface of a substrate in a direction perpendicular to an upper surface of the substrate;

a channel region penetrating through the plurality of gate electrodes to extend perpendicularly to the upper surface of the substrate; and

a gate dielectric layer including a tunneling layer, a charge storage layer and a blocking layer that are sequentially disposed between the channel region and the plurality of gate electrodes,

wherein the charge storage layer includes a plurality of doping elements and a plurality of deep level traps generated by the plurality of doping elements,

wherein a concentration distribution of the plurality of doping elements in a thickness direction of the charge storage layer is non-uniform

wherein the charge storage layer includes silicon nitride, and

wherein the concentration distribution of the plurality of doping elements has a maximum concentration of about 2 at. % to about 7 at. % of nitrogen (N) concentration of the charge storage layer.

2. The semiconductor device of claim 1 ,

wherein the plurality of doping elements include at least one of carbon (C), boron (B), lanthanum (La), hafnium (Hf), zirconium (Zr), aluminum (Al) and yttrium (Y).

3. The semiconductor device of claim 1 ,

wherein the concentration distribution of the plurality of doping elements has the maximum concentration at a center portion of the charge storage layer in the thickness direction thereof with a concentration decreasing away from the center portion toward both edges of the charge storage layer in the thickness direction.

4. The semiconductor device of claim 1 ,

wherein the concentration distribution of the plurality of doping elements has a concentration decreasing toward an edge of the charge storage layer in the thickness direction thereof.

5. The semiconductor device of claim 1 ,

wherein the plurality of doping elements are bonded with nitrogen (N) of the charge storage layer.

6. The semiconductor device of claim 1 , further comprising:

an impurity providing layer disposed to be in contact with the charge storage layer and provide the plurality of doping elements to the charge storage layer.

7. The semiconductor device of claim 6 ,

wherein the impurity providing layer is disposed in the charge storage layer to be located in a center portion of the charge storage layer in the thickness direction.

8. The semiconductor device of claim 6 ,

wherein the impurity providing layer is disposed on at least one edge of the charge storage layer in the thickness direction.

9. The semiconductor device of claim 6 ,

wherein the impurity providing layer includes a plurality of elements including at least one of carbon (C), boron (B), lanthanum (La), hafnium (Hf), zirconium (Zr), aluminum (Al) and yttrium (Y), and

wherein the plurality of elements and the plurality of doping elements are the same in kind.

10. The semiconductor device of claim 9 ,

wherein the impurity providing layer includes at least one of SiCN, SiBN, LaO, HfO, ZrO, AlO and YO.

11. The semiconductor device of claim 10 ,

wherein the charge storage layer further includes oxygen (O) diffused from the impurity providing layer.

12. The semiconductor device of claim 6 ,

wherein a thickness of the impurity providing layer is less than about 10 Å.

13. The semiconductor device of claim 1 ,

wherein the blocking layer includes a first layer and a second layer,

wherein the first layer is disposed to be in contact with the charge storage layer and

wherein the first layer includes a silicon oxide and a second layer includes a high-k dielectric material.

14. A semiconductor device comprising:

a plurality of gate electrodes stacked on a substrate in a direction perpendicular to an upper surface of the substrate;

a channel region penetrating through the plurality of gate electrodes to extend perpendicularly to the upper surface of the substrate;

a gate dielectric layer including a tunneling layer, a charge storage layer and a blocking layer that are sequentially disposed between the channel region and the plurality of gate electrodes; and

an impurity providing layer disposed to be in contact with the charge storage layer,

wherein the charge storage layer includes a silicon nitride doped with a plurality of doping elements including at least one of C, B, La, Hf, Zr, Al and Y, and

wherein the charge storage layer has a concentration distribution of the plurality of doping elements with a maximum concentration in a region of which the charge storage layer is in contact with the impurity providing layer.

15. The semiconductor device of claim 14 ,

wherein the plurality of doping elements are non-uniformly distributed in the charge storage layer in a thickness direction.

16. A semiconductor device comprising:

a gate electrode disposed on a channel region; and

a gate dielectric layer including a tunneling layer, a charge storage layer, and a blocking layer that are sequentially disposed between the channel region and the gate electrode,

wherein the charge storage layer includes a plurality of doping elements forming a plurality of deep level traps, and the plurality of doping elements are at least one of C, B, La, Hf, Zr, Al and Y,

wherein the charge storage layer includes silicon nitride, and

wherein a concentration distribution of the plurality of doping elements has a maximum concentration of about 2 at. % to about 7 at. % of nitrogen (N) concentration of the charge storage layer.

17. The semiconductor device of claim 16 ,

wherein the plurality of doping elements are non-uniformly distributed in the charge storage layer in a thickness direction.