Vertical transport fin field effect transistor with asymmetric channel profile
A method of forming a plurality of vertical fin field effect transistors is provided. The method includes forming a first vertical fin on a first region of a substrate and a second vertical fin on a second region of the substrate, forming an isolation region between the first region and the second region, forming a gate dielectric layer on the vertical fins, forming a first work function layer on the gate dielectric layer, removing an upper portion of the first work function layer from the vertical fin on the first region and the vertical fin on the second region, and forming a second work function layer on the first work function layer and the exposed upper portion of the gate dielectric layer, wherein the first work function layer and second work function layer forms a first combined work function layer with a step in the second work function layer.
1. A plurality of vertical fin field effect transistors, comprising:
a first vertical fin on a first region of a substrate and a second vertical fin on a second region of the substrate;
an isolation region between the first region and the second region;
a gate dielectric layer on the first vertical fin and the second vertical fin;
a first combined work function layer on a lower portion of the gate dielectric layer on the second vertical fin;
a second work function layer on an upper portion of the gate dielectric layer on the second vertical fin;
a second combined work function layer on a lower portion of the gate dielectric layer on the first vertical fin; and
a fourth work function layer on an upper portion of the gate dielectric layer on the first vertical fin.
2. The plurality of vertical fin field effect transistors of claim 1 , further comprising a first bottom source/drain region on the first region of the substrate and a second bottom source/drain region on the second region of the substrate, wherein the first bottom source/drain region is doped with an n-type dopant, and the second bottom source/drain region is doped with a p-type dopant.
3. The plurality of vertical fin field effect transistors of claim 2 , wherein the third and fourth work function layers each have a thickness in the range of about 1 nm to about 10 nm.
4. The plurality of vertical fin field effect transistors of claim 3 , wherein the first and second work function layers each have a thickness in the range of about 1 nm to about 10 nm.
5. The plurality of vertical fin field effect transistors of claim 4 , wherein the first and second work function layers are a different work function material from the third and fourth work function layers.
6. A plurality of vertical fin field effect transistors, comprising:
a first bottom source/drain region on a first region of a substrate and a second bottom source/drain region on a second region of the substrate with an isolation region between the first region and the second region;
a first vertical fin on the first region of the substrate and a second vertical fin on the second region of the substrate;
a gate dielectric layer on the first vertical fin and the second vertical fin;
a first combined work function layer on a lower portion of the gate dielectric layer on the second vertical fin;
a second work function layer on an upper portion of the gate dielectric layer on the second vertical fin;
a second combined work function layer on a lower portion of the gate dielectric layer on the first vertical fin; and
a fourth work function layer on an upper portion of the gate dielectric layer on the first vertical fin.
7. The plurality of vertical fin field effect transistors of claim 6 , wherein the fourth work function layer covers about 10% to about 25% of the vertical fin height on the upper portion of the gate dielectric layer on the first vertical fin, and the second work function layer covers about 10% to about 25% of the vertical fin height on the upper portion of the gate dielectric layer on the second vertical fin.
8. The plurality of vertical fin field effect transistors of claim 7 , further comprising the second combined work function layer on the second work function layer on the second vertical fin.
9. The plurality of vertical fin field effect transistors of claim 8 , wherein the first and second work function layers are selected from the group consisting of titanium nitride (TiN), tantalum nitride (TaN), and ruthenium (Ru), and the third and fourth work function layers are selected from the group consisting of titanium nitride (TiN), titanium aluminum nitride (TiAlN), titanium aluminum carbon nitride (TiAlCN), titanium aluminum carbide (TiAlC), tantalum aluminum carbide (TaAlC), tantalum aluminum carbon nitride (TaAlCN), lanthanum (La) doped TiN, and lanthanum (La) doped TaN.
10. The plurality of vertical fin field effect transistors of claim 9 , wherein the first bottom source/drain region is doped with an n-type dopant, and the second bottom source/drain region is doped with a p-type dopant.