GALLIUM-69 ENRICHED TARGET BODIES
Gallium target bodies for producing germanium-68 are disclosed. The targets include an alloy of a base metal and gallium. The alloy is enriched in gallium-69 to increase germanium-68 production. Methods for producing such alloys by electroplating are also disclosed.
1 . A target body for producing geramium-68, the target body comprising:
a target substrate plate;
an alloy that forms an interface with the substrate plate, the alloy comprising:
gallium, with greater than 60% of the gallium being gallium-69; and
a base metal selected from the group consisting of nickel, iron, cobalt, copper and tungsten.
2 . The target body as set forth in claim 1 wherein the base metal is nickel.
3 . The target body as set forth in claim 1 wherein the target substrate plate comprises copper.
4 . The target body as set forth in claim 1 wherein the alloy comprises at least about 10 wt % gallium.
5 . The target body as set forth in claim 1 wherein the alloy comprises at least about 50 wt % gallium.
6 . The target body as set forth in claim 1 wherein the alloy comprises at least about 75 wt % gallium.
7 . The target body as set forth in claim 1 wherein the alloy comprises an amount of gallium-71, the molar ratio of gallium-69 to gallium-71 being at least about 1:1.
8 . The target body as set forth in claim 1 wherein the alloy comprises an amount of gallium-71, the molar ratio of gallium-69 to gallium-71 being at least about 5:1.
9 . The target body as set forth in claim 1 wherein at least about 65% of the gallium in the alloy is gallium-69.
10 . The target body as set forth in claim 1 wherein at least about 95% of the gallium in the alloy is gallium-69.
11 . A method for forming germanium-68, the method comprising operating a cyclotron or linear accelerator to bombard the target body as set forth in claim 1 , the bombarded target decaying to produce germanium-68.
12 . A method for forming a target body, the method comprising:
contacting a target substrate plate with a plating bath comprising a base metal selected from the group consisting of nickel, iron, cobalt, copper and tungsten;
contacting the target substrate plate with a plating bath comprising gallium, at least 60% of the gallium being gallium-69; and
electroplating nickel and gallium-69 onto the target substrate plate to form an alloy of base metal and gallium-69.
13 . The method as set forth in claim 12 wherein the plating bath comprising a metal selected from the group consisting of nickel, iron, cobalt, copper and tungsten and the plating bath comprising gallium-69 are the same plating bath.
14 . The method as set forth in claim 12 wherein the plating bath comprising a base metal selected from the group consisting of nickel, iron, cobalt, copper and tungsten is a base metal plating bath and the plating bath comprising gallium-69 is a gallium-69 plating bath that is separate from the base metal plating bath, the target substrate plate contacting the base metal plating bath and the gallium-69 plating bath in succession to alternate electroplating of gallium-69 and the base metal.
15 . The method as set forth in claim 12 wherein the base metal is nickel and a nickel-gallium alloy is formed on the substrate and greater than 60% of gallium in the nickel-gallium alloy is gallium-69.
16 . The method as set forth in claim 12 wherein the target substrate plate comprises copper.
17 . The method as set forth in claim 12 wherein the base metal-gallium alloy comprises an amount of gallium-71, the molar ratio of gallium-69 to gallium-71 being at least about 1:1.
18 . The method as set forth in claim 12 wherein the base metal-gallium alloy comprises an amount of gallium-71, the molar ratio of gallium-69 to gallium-71 being at least about 9:1.
19 . The method as set forth in claim 12 wherein at least about 65% of the gallium in the gallium plating bath is gallium-69.
20 . The method as set forth in claim 12 wherein at least about 85% of the gallium in the gallium plating bath is gallium-69.