Semiconductor device
A transistor having high field-effect mobility is provided. A transistor having stable electrical characteristics is provided. A transistor having small current in an off state (in a non-conductive state) is provided. A semiconductor device including such a transistor is provided. A first electrode is formed over a substrate, a first insulating layer is formed adjacent to a side surface of the first electrode, and a second insulating layer is formed to cover the first insulating layer and be in contact with at least part of a surface of the first electrode. The surface of the first electrode is formed of a conductive material that does not easily transmit an impurity element. The second insulating layer is formed of an insulating material that does not easily transmit an impurity element. An oxide semiconductor layer is formed over the first electrode with a third insulating layer provided therebetween.
1. A semiconductor device comprising:
a first conductive film;
a second conductive film over the first conductive film;
a first insulating film in direct contact with a side surface of the first conductive film;
a second insulating film over the second conductive film and the first insulating film;
a first oxide semiconductor film over the second insulating film;
a second oxide semiconductor film over the first oxide semiconductor film;
a source electrode and a drain electrode over the second oxide semiconductor film;
a third oxide semiconductor film over the second oxide semiconductor film, the source electrode and the drain electrode,
a third insulating film over the third oxide semiconductor film;
a third conductive film over the third oxide semiconductor film with the third insulating film provided therebetween; and
a fourth insulating film over the third conductive film,
wherein the fourth insulating film is in contact with the third conductive film, a side surface of the third insulating film and a side surface of the third oxide semiconductor film.
2. The semiconductor device according to claim 1 ,
wherein the second insulating film is in contact with a top surface of the second conductive film.
3. The semiconductor device according to claim 1 ,
wherein the side surface of the third insulating film is aligned with a side surface of the third conductive film.
4. The semiconductor device according to claim 1 ,
wherein the second conductive film comprises indium tin oxide, indium tin oxide containing silicon, phosphorus, boron, nitrogen, or carbon, or indium gallium zinc oxide containing silicon, phosphorus, boron, nitrogen, or carbon.
5. The semiconductor device according to claim 1 ,
wherein the fourth insulating film comprises aluminum oxide, aluminum nitride, aluminum oxynitride, aluminum nitride oxide, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide.
6. The semiconductor device according to claim 1 ,
wherein an electron affinity of the second oxide semiconductor film is larger than an electron affinity of the first oxide semiconductor film and an electron affinity of the third oxide semiconductor film.
7. The semiconductor device according to claim 1 ,
wherein the second insulating film comprises aluminum oxide.
8. A semiconductor device comprising:
a first conductive film;
a second conductive film over the first conductive film;
a first insulating film in direct contact with a side surface of the first conductive film;
a second insulating film over the second conductive film and the first insulating film;
a first oxide semiconductor film over the second insulating film;
a second oxide semiconductor film over the first oxide semiconductor film;
a source electrode and a drain electrode over the second oxide semiconductor film;
a third oxide semiconductor film over the second oxide semiconductor film, the source electrode and the drain electrode,
a third insulating film over the third oxide semiconductor film;
a third conductive film over the third oxide semiconductor film with the third insulating film provided therebetween; and
a fourth insulating film over the third conductive film,
wherein the second insulating film is in contact with a top surface of the second conductive film, and
wherein the fourth insulating film is in contact with the second insulating film.
9. The semiconductor device according to claim 8 ,
wherein a side surface of the third insulating film is aligned with a side surface of the third conductive film.
10. The semiconductor device according to claim 8 ,
wherein the second conductive film comprises indium tin oxide, indium tin oxide containing silicon, phosphorus, boron, nitrogen, or carbon, or indium gallium zinc oxide containing silicon, phosphorus, boron, nitrogen, or carbon.
11. The semiconductor device according to claim 8 ,
wherein the second conductive film comprises indium gallium zinc oxide containing nitrogen.
12. The semiconductor device according to claim 8 ,
wherein the fourth insulating film comprises aluminum oxide, aluminum nitride, aluminum oxynitride, aluminum nitride oxide, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide.
13. The semiconductor device according to claim 8 ,
wherein an electron affinity of the second oxide semiconductor film is larger than an electron affinity of the first oxide semiconductor film and an electron affinity of the third oxide semiconductor film.
14. The semiconductor device according to claim 8 ,
wherein the second insulating film comprises aluminum oxide.