Image sensor device and manufacturing method for improving shutter efficiency
View Patent ↗A semiconductor device includes a semiconductive substrate and a gate structure over the semiconductive substrate. The semiconductive substrate includes a photo-sensitive region adjacent to the gate structure, and the gate structure is configured to store electric charge generated from the photo-sensitive region. The semiconductor device also includes a conductive structure over the semiconductive substrate. The conductive structure circumscribes and is spaced apart from a sidewall of the gate structure.
1. A semiconductor device, comprising:
a semiconductive substrate;
a gate structure over the semiconductive substrate, wherein the semiconductive substrate includes a photo-sensitive region adjacent to the gate structure, and the gate structure is configured to store electric charge generated by the photo-sensitive region;
a conductive structure over the semiconductive substrate, the conductive structure circumscribing and spaced apart from a sidewall of the gate structure;
a dielectric film covering the gate structure; and
a dielectric layer laterally surrounding the gate structure and the dielectric film, wherein the dielectric layer comprises a top surface facing the conductive structure and a bottom surface facing the semiconductive substrate, a width of the top surface of the dielectric layer is greater than a width of the bottom surface of the dielectric layer, and a top surface of the dielectric film is exposed through the dielectric layer.
2. The semiconductor device according to claim 1 , wherein the conductive structure has a top portion covering a top surface of the gate structure from a top view perspective.
3. The semiconductor device according to claim 2 , wherein the conductive structure has a peripheral portion surrounding and spaced apart from the sidewall of the gate structure.
4. The semiconductor device according to claim 3 , wherein the dielectric layer comprises an outer sidewall facing the peripheral portion of the conductive structure and an inner sidewall facing the sidewall of the gate structure, and an upper portion of the inner sidewall exhibits a curvature greater than that of an upper portion of the outer sidewall.
5. The semiconductor device according to claim 1 , wherein the dielectric film conformally covers the gate structure.
6. The semiconductor device according to claim 5 , further comprising a conductive plug extending through the conductive structure and terminating on the dielectric film.
7. The semiconductor device according to claim 1 , wherein the dielectric film extends between the bottom surface of the dielectric layer and the semiconductive substrate.
8. The semiconductor device according to claim 1 , wherein the top surface of the dielectric film is coplanar with an upper surface of the dielectric layer.
9. The semiconductor device according to claim 1 , wherein the dielectric film contacts a sidewall of the gate structure.
10. A semiconductor device, comprising:
a semiconductive substrate;
a gate structure over the semiconductive substrate, wherein the semiconductive substrate includes a well region aligned with the gate structure and a photo-sensitive region adjacent to the gate structure, and the gate structure is configured to store electric charge generated by the photo-sensitive region through the well region;
a conductive structure over the gate structure, the conductive structure comprising a peripheral portion and a top portion covering the peripheral portion, the top portion comprising a uniform thickness throughout an entirety of the top portion and extending beyond the peripheral portion, the peripheral portion having a height substantially greater than a height of the gate structure and being spaced apart from a sidewall of the gate structure, and the peripheral portion being in contact with the well region; and
a first dielectric layer overlapping the gate structure and a second dielectric layer laterally surrounding the first dielectric layer, wherein the second dielectric layer comprises a top portion adjacent to the top portion of the conductive structure and a bottom portion adjacent to the semiconductive substrate, and the top portion of the second dielectric layer comprises a width greater than a width of the bottom portion of the second dielectric layer.
11. The semiconductor device according to claim 10 , wherein the top portion of the second dielectric layer is coplanar with a top portion of the first dielectric layer.
12. The semiconductor device according to claim 10 , further comprising a third dielectric layer laterally surrounding the conductive structure, wherein the top portion of the conductive structure comprises a bottom surface facing the gate structure and the peripheral portion, and the third dielectric layer is in contact with the bottom surface of the top portion of the conductive structure.
13. The semiconductor device according to claim 10 , further comprising a conductive plug disposed within and electrically insulated from the conductive structure.
14. The semiconductor device according to claim 13 , further comprising an interconnect layer disposed over the gate structure and electrically coupled to the conductive plug.
15. The semiconductor device according to claim 14 , further comprising a light pipe extending through the interconnect layer and configured to direct photons to the photo-sensitive region.
16. A semiconductor device, comprising:
a semiconductive substrate;
a gate structure over the semiconductive substrate, wherein the semiconductive substrate includes a photo-sensitive region corresponding to the gate structure, and the gate structure is configured to store electric charge generated by the photo-sensitive region;
a dielectric film conformally covering a sidewall and an upper surface of the gate structure;
a conductive structure over the gate structure and the dielectric film, the conductive structure comprising a peripheral portion extending toward a surface of the semiconductive substrate and a top portion covering the peripheral portion;
a first dielectric layer filling a space between the dielectric film and the conductive structure; and
a conductive plug extending through the top portion, separated from the top portion and terminating on an upper surface of the dielectric film.
17. The semiconductor device according to claim 16 , wherein the dielectric film extends over the semiconductive substrate on a side of the peripheral portion opposite to the gate structure.
18. The semiconductor device according to claim 16 , wherein the dielectric film contacts a top portion of the gate structure.
19. The semiconductor device according to claim 16 , further comprising a second dielectric layer between the gate structure and the semiconductive substrate, wherein the dielectric film conformally covers sidewalls of the gate structure and the second dielectric layer.