Integrated circuit device fins

1. A method comprising:

receiving a substrate that includes:

a plurality of fins extending above a remainder of the substrate;

a first region that includes a first fence region that contains a first subset of the plurality of fins; and

a second region that includes a second fence region that contains a second subset of the plurality of fins;

wherein the first region has a first performance characteristic; and

wherein the second region has a second performance characteristic that is different from the first performance characteristic;

based on the first performance characteristic, recessing the first subset of the plurality of fins to a first height; and

based on the second performance characteristic, recessing the second subset of the plurality of fins to a second height that is less than the first height, and

wherein the first region of the substrate further includes a first guard ring region that is free of fins, and wherein each fin of the first subset extends above a top surface of the substrate in the first guard ring region.

2. The method of claim 1 , wherein each fin of the first subset extends between about 1 Å and about 500 Å above the top surface of the substrate in the first guard ring region.

3. The method of claim 1 , wherein an entirety of the top surface of the substrate in the first fence region is at or above the top surface of the substrate in the first guard ring region.

4. The method of claim 1 , wherein the second region of the substrate further includes a second guard ring region that is free of fins, and wherein each fin of the second subset is recessed below the top surface of the substrate in the second guard ring region.

5. The method of claim 4 , wherein each fin of the second subset is between about 1 Å and about 500 Å below the top surface of the substrate in the second guard ring region.

6. The method of claim 4 , wherein an entirety of the top surface of the substrate in the second fence region is at or below the top surface of the substrate in the second guard ring region.

7. The method of claim 4 further comprising forming a first isolation feature on the first guard ring region and the first subset of the plurality of fins and a second isolation feature on the second guard ring region and the second subset of the plurality of fins.

8. The method of claim 1 further comprising forming circuit devices on the plurality of fins within the first region and the second region, wherein the first performance characteristic includes a first device density and the second performance characteristic includes a second device density.

9. The method of claim 1 further comprising forming circuit devices on the plurality of fins within the first region and the second region, wherein the recessing of the first subset of the plurality of fins is based on forming SRAM devices in the first region and the recessing of the second subset of the plurality of fins is based on forming logic devices in the second region.

10. A method comprising:

receiving a workpiece that includes:

a substrate;

a hard mask layer disposed on the substrate; and

a patterned layer disposed on the hard mask layer such that the patterned layer exposes a first portion and a second portion of the hard mask layer;

etching the first portion and the second portion of the hard mask layer such that the etching etches a first portion of the substrate underlying the first portion of the hard mask layer without significantly etching a second portion of the substrate underlying the second portion of the hard mask layer; and

etching the substrate to define a plurality of fins such that a first trench adjacent a fin of the plurality of fins extends to a depth that is greater than a depth of a second trench adjacent the fin.

11. The method of claim 10 further comprising forming a transistor on the fin.

12. The method of claim 10 wherein the hard mask layer is recessed such that a top surface of the first portion of the hard mask layer is below a top surface of the second portion of the hard mask layer.

13. The method of claim 10 further comprising forming isolation features within the first trench and the second trench.

14. The method of claim 10 , wherein the etching of the substrate forms a first guard ring region in a first region of the workpiece, the method further comprising:

selectively recessing a first subset of the plurality of fins within a first fence region adjacent the first guard ring region to be below a remainder of the plurality of fins, wherein each fin in the first subset extends above a top surface of the substrate within the first guard ring region.

15. The method of claim 14 , wherein the etching of the substrate forms a second guard ring region in a second region of the workpiece, the method further comprising:

selectively recessing a second subset of the plurality of fins within a second fence region adjacent the second guard ring region to be below the top surface of the substrate within the second guard ring region, wherein an entirety of the top surface of the substrate within the second fence region is at or above the top surface of the substrate within the second guard ring region.

16. A method comprising:

receiving a workpiece that includes a substrate and a mask layer on the substrate;

patterning the mask layer;

patterning the substrate based on the patterned mask layer to define a plurality of fins;

etching a first subset of the plurality of fins to extend to a first height;

etching a second subset of the plurality of fins to be below the first height; and

forming isolation features on the first and second subsets of the plurality of fins, and

wherein the patterning of the substrate defines a guard ring region that is free of fins adjacent the second subset of the plurality of fins, and wherein the etching of the second subset of the plurality of fins creates a recess that extends below a topmost surface of the substrate in the guard ring region.

17. The method of claim 16 , wherein the patterning of the mask layer defines a plurality of regions of the mask layer such that first and second regions of the substrate are exposed between the plurality of regions of the mask layer, and wherein the patterning of the mask layer creates a recess in the first region of the substrate that extends below the substrate in the second region.

18. The method of claim 16 , wherein the etching of the second subset of the plurality of fins removes the second subset of the plurality of fins.

19. The method of claim 16 , wherein the first height of the first subset of the plurality of fins is higher than the top surface of the substrate in the guard ring region.

20. The method of claim 16 , wherein the patterning of the substrate defines another guard ring region that is free of fins, and

wherein the guard region is disposed on a first side of the second subset of the plurality of fins and the another guard region is disposed on an opposing second side of the second subset of the plurality of fins.