Network processor FPGA (npFPGA): multi-die-FPGA chip for scalable multi-gigabit network processing
Systems and methods are provided for reducing power consumption of a multi-die device, such as a network processor FPGA (npFPGA). The multi-die device may include hardware resources such as FPGA dies, which may be coupled to NIC dies and/or memory dies. Power consumption of the multi-die device may be reduced by monitoring usage of hardware resources in the multi-die device, identifying hardware resources that are not in use, and gating power to the identified hardware resources. The status of processing elements (PEs) in the multi-die device may be tracked in a PE state table. Based on the PE state table, tasks from a task queue may be assigned to one or more processing elements.
1. A multi-die network processor device, comprising:
a network interface controller (NIC) die comprising NIC circuitry configured to implement an Ethernet media access control (MAC) protocol;
a peripheral component interconnect express (PCIe) die comprising PCIe circuitry configured to implement a PCIe protocol; and
a memory die configured to store network packets, wherein the NIC die, the PCIe, and the memory die are coupled to a single substrate of the multi-die network processor device and communicatively coupled using an interconnect, wherein the PCIe die is power gated for at least a portion of a first operation performed by the multi-die network processor device in response to the NIC die being used and the PCIe die being unused by the multi-die network processor device during at least the portion of the first operation, wherein the NIC die is power gated for at least a portion of a second operation in response to the PCIe die being used and the NIC die being unused by the multi-die network processor device during at least the portion of the second operation, and wherein the multi-die network processor device is configured to communicate network-related data via at least the NIC die during the first operation while the PCIe die is power gated when unused during the first operation and communicate via the PCIe die during the second operation while the NIC die is power gated when unused during the second operation.
2. The multi-die network processor device of claim 1 , wherein the NIC circuitry comprises a soft intellectual property block, a hard intellectual property block, or any combination thereof.
3. The multi-die network processor device of claim 1 , comprising a programmable die that comprises programmable fabric, wherein the programmable fabric is configured to implement a function on the network packets.
4. The multi-die network processor device of claim 3 , wherein the function comprises a routing function, a quality of service function, or a forward error correction function.
5. The multi-die network processor device of claim 3 , wherein the programmable die comprises the NIC die or the PCIe die.
6. The multi-die network processor device of claim 1 , wherein the NIC circuitry comprises a 1×400G controller, a 4×100G controller, a 4×40G controller, or a 16×10G controller.
7. The multi-die network processor device of claim 1 , wherein the PCIe circuitry comprises a PCIe Gen3×16 controller or a PCIe Gen4×16 controller.
8. The multi-die network processor device of claim 1 , wherein the memory die comprises a hybrid memory cube (HMC), a parallel synchronous dynamic random-access memory (SDRAM), a double data rate (DDR)/quadruple data rate (QDR) static random-access memory (SRAM), or a ternary content-addressable memory (TCAM).
9. A multi-die line card device, comprising:
a first network interface controller (NIC) die comprising a first NIC circuitry configured to implement an Ethernet media access control (MAC) protocol;
a second NIC die comprising a second NIC circuitry configured to implement an Interlaken MAC protocol, the second NIC die different than the first NIC die; and
a first programmable logic circuitry comprising a user logic configured to implement a function on network traffic between the first NIC die and the second NIC die, wherein the first NIC die, the second NIC die, and the first programmable logic circuitry are coupled to a single substrate of the multi-die line card device and communicatively coupled using an interconnect, wherein the first NIC die, the second NIC die, or a combination thereof, are power gated for at least a portion of a first operation performed by the multi-die line card device in response to being unused by the multi-die line card device during at least the portion of the first operation, and wherein the multi-die line card is configured to communicate network-related data via the first NIC die when the second NIC die is power gated while unused during the at least the portion of the first operation and via the second NIC die when the first NIC die is power gated while unused during a second operation.
10. The multi-die line card device of claim 9 , wherein the first programmable logic circuitry is comprised in the first NIC die or the second NIC die.
11. The multi-die line card device of claim 9 , comprising a programmable die that comprises the first programmable logic circuitry.
12. The multi-die line card device of claim 9 , wherein the function on the network traffic comprises a routing function, a quality of service function, or a forward error correction function.
13. The multi-die line card device of claim 9 , wherein the first NIC circuitry comprises a 1×400G controller, a 4×100G controller, a 4×40G controller, or a 16×10G controller.
14. The multi-die line card device of claim 9 , wherein the second NIC circuitry comprises a 16×12.5G Interlaken controller or 16×25G Interlaken controller.
15. The multi-die line card device of claim 9 , wherein the first NIC circuitry comprises a first hard logic intellectual property (hard IP) and the second NIC circuitry comprises a second hard IP.
16. The multi-die line card device of claim 9 , comprising a memory die coupled to the single substrate, wherein the memory die is configured to store network packets.
17. The multi-die line card device of claim 16 , wherein the memory die comprises a hybrid memory cube (HMC), a parallel synchronous dynamic random-access memory (SDRAM), a double data rate (DDR)/quadruple data rate (QDR) static random-access memory (SRAM), or a ternary content-addressable memory (TCAM).
18. A multi-die line card device, comprising:
a first network interface controller (NIC) die comprising a first NIC circuitry configured to implement an Optical Transport Network (OTN) protocol;
a second NIC die comprising a second NIC circuitry configured to implement an Interlaken protocol; and
a memory die configured to store network packets, wherein the first NIC die, the second NIC die, and the memory die are coupled to a single substrate of the multi-die line card device and communicatively coupled using an interconnect, wherein the first NIC die, the second NIC die, or a combination thereof, are power gated for at least a portion of a first operation performed by the multi-die line card device in response to the memory die being used and the first NIC die, the second NIC die, or the combination thereof, being unused by the multi-die line card device during the at least the portion of the first operation, and wherein the memory die is power gated for at least a second or third portion of the operation in response to the first NIC die, the second NIC die, or the combination thereof, being used and the memory die being unused by the multi-die line card device during at least a portion of a second or a third operation, and wherein the multi-die line card is configured to communicate network-related data via the first NIC die when the second NIC die is power gated while unused during the at least the portion of the second operation or the third operation and via the second NIC die when the first NIC die is power gated while unused during the at least portion of the third operation while the first NIC die or the second NIC die is power gated.
19. The multi-die line card device of claim 18 , wherein the memory die comprises a hybrid memory cube (HMC), a parallel synchronous dynamic random-access memory (SDRAM), a double data rate (DDR)/quadruple data rate (QDR) static random-access memory (SRAM), or a ternary content-addressable memory (TCAM).
20. The multi-die line card device of claim 18 , wherein the first NIC circuitry comprises a soft intellectual property block, a hard intellectual property block, or any combination thereof.
21. The multi-die line card device of claim 18 , comprising a programmable die that comprises programmable fabric, wherein the programmable fabric is configured to implement a function on the network packets.
22. The multi-die line card device of claim 21 , wherein the function comprises a routing function, a quality of service function, or a forward error correction function.
23. The multi-die line card device of claim 18 , wherein the second NIC circuitry comprises a 16×12.5G Interlaken controller or 16×25G Interlaken controller.