SUBSTRATE TREATMENT APPARATUS
A substrate treatment apparatus includes: a substrate holding unit; a rotator for rotating the substrate holding unit; a first liquid nozzle for supplying a rinsing liquid; a second liquid nozzle for supplying a low surface tension liquid; a heater ; a lifting mechanism for relatively moving up and down the heater between a contact position allowing the heater to be brought into contact with the lower surface of the substrate and a separation position allowing the heater to be separated from the substrate; a gas nozzle provided in an upper surface of the heater to suck the substrate; a suction pump for sucking an atmosphere above the heater through the gas nozzle; a gas supply source for supplying an inert gas toward above the heater through the gas nozzle; and a controller for selectively performing suction of the atmosphere or supply of the inert gas, through the gas nozzle.
1 . A substrate treatment apparatus comprising:
a substrate holding unit provided with a chuck member that holds a circumference of a substrate;
a rotator for rotating the substrate holding unit around a rotating axis;
a first liquid nozzle for supplying a rinsing liquid to an upper surface of the substrate held by said chuck member;
a second liquid nozzle for supplying a low surface tension liquid to replace said rinsing liquid to the upper surface of said substrate;
a heater for heating said substrate from a lower surface of said substrate;
a lifting mechanism for relatively moving up and down said heater between a contact position allowing said heater to be brought into contact with the lower surface of said substrate and a separation position allowing said heater to be separated from the lower surface of said substrate;
a gas nozzle provided in an upper surface of said heater to suck said substrate;
a suction pump for sucking an atmosphere above said heater through said gas nozzle;
a gas supply source for supplying an inert gas toward above said heater through said gas nozzle; and
a controller for selectively performing said suction of the atmosphere or the supply of said inert gas, through said gas nozzle.
2 . The substrate treatment apparatus according to claim 1 , wherein
said heater is provided with a push-up pin unit for pushing up said substrate sucked onto the upper surface of said heater.