Capacitor structure and semiconductor device including the same

1. A capacitor structure for a dynamic random access memory (DRAM) cell, comprising:

a plurality of bottom electrodes including first, second, and third rows of bottom electrodes, the bottom electrodes in each row of the first to third rows being horizontally spaced apart from each other, the first row being adjacent to the second row and the second row being adjacent to the third row, each bottom electrode being formed in a cylindrical structure and thereby including an inner side surface, an outer side surface, and an upper surface, and the bottom electrodes in the first row having offsets in a horizontal direction from the bottom electrodes in the second row, and the bottom electrodes in the first row having no offsets in the horizontal direction from the bottom electrodes in the third row;

a lower support pattern disposed at a middle portion of each bottom electrode of the plurality of bottom electrodes and contacting the outer side surface of each bottom electrode of the plurality of bottom electrodes, the lower support pattern including a plurality of first openings, each of which extends to the outer side surface of at least one bottom electrode in the first row of the plurality of bottom electrodes and extends to the outer side surface of at least one bottom electrode in the second row of the plurality of bottom electrodes;

an upper support pattern disposed at a top portion of the plurality of bottom electrodes and contacting the outer side surface of each bottom electrode of the plurality of bottom electrodes, a lower surface of the upper support pattern being positioned at a lower level than the upper surface of each bottom electrode of the plurality of bottom electrodes and an upper surface of the upper support pattern being positioned at a higher level than the upper surface of each bottom electrode of the plurality of bottom electrodes, the upper support pattern including a plurality of second openings, each of which extends to the outer side surface of at least one bottom electrode in the first row of the plurality of bottom electrodes and extends to the outer side surface of at least one bottom electrode in the second row of the plurality of bottom electrodes, wherein each of the plurality of first openings vertically overlaps a corresponding second opening among the plurality of second openings;

a dielectric layer covering upper and lower surfaces of the lower support pattern and upper and lower surfaces of the upper support pattern, and continuously extending along the outer side surface, the inner side surface, and the upper surface of each bottom electrode of the plurality of bottom electrodes and a side surface of the upper support pattern; and

a top electrode covering the dielectric layer,

wherein a first set of openings, including a first opening among the plurality of first openings and a second opening among the plurality of second openings and corresponding to the first opening, extends to the outer side surface of the at least one bottom electrode in the first row of the plurality of bottom electrodes and extends to the outer side surface of the at least one bottom electrode in the second row of the plurality of bottom electrodes, and a number of the bottom electrodes in the first row at least partially disposed within the first set of openings is different from a number of the bottom electrodes in the second row disposed within the first set of openings, and

wherein bottom electrodes in the third row adjacent to the second row are surrounded by the lower support pattern and the upper support pattern in a plan view and contact neither the plurality of first openings nor the plurality of second openings.

2. The capacitor structure of claim 1 , wherein the plurality of first openings and the plurality of second openings are arranged periodically in both row and column directions respectively, and

wherein at least one bottom electrode in the third row of the plurality of bottom electrodes is disposed to penetrate the lower support pattern between two first openings of the plurality of first openings and to penetrate the upper support pattern between two second openings of the plurality of second openings.

3. The capacitor structure of claim 1 , wherein the upper support pattern has a thickness greater than that of the lower support pattern.

4. The capacitor structure of claim 1 , wherein a portion of a sidewall of the upper support pattern extends above the upper surface of each bottom electrode of the plurality of bottom electrodes.

5. The capacitor structure of claim 1 , wherein the plurality of first openings of the lower support pattern are vertically aligned with the plurality of second openings of the upper support pattern, and each of the plurality of first openings and the plurality of second openings is filled with the top electrode.

6. The capacitor structure of claim 5 , wherein an inner space formed in the cylindrical structure of each bottom electrode is filled with the top electrode.

7. The capacitor structure of claim 1 , wherein the inner side surface, the outer side surface and the upper surface of each bottom electrode, except for the portion contacting the lower support pattern and the upper support pattern, are covered with the dielectric layer.

8. The capacitor structure of claim 1 , wherein each bottom electrode of the plurality of bottom electrodes penetrates the upper support pattern and the lower support pattern respectively.

9. The capacitor structure of claim 1 , wherein each bottom electrode of the plurality of bottom electrodes is electrically connected to a drain region of metal-oxide-semiconductor (MOS) transistor through a buried contact.

10. A capacitor structure for a dynamic random access memory (DRAM) cell, comprising:

a plurality of bottom electrodes including first and second rows of bottom electrodes, the bottom electrodes in each row of the first and second rows being horizontally spaced apart from each other, the first row being adjacent to the second row, each bottom electrode being formed in a cylindrical structure and thereby including an inner side surface, an outer side surface, and an upper surface, and the bottom electrodes in the first row having offsets in a horizontal direction from the bottom electrodes in the second row;

a lower support pattern disposed at a middle portion of each bottom electrode of the plurality of bottom electrodes and contacting the outer side surface of each bottom electrode of the plurality of bottom electrodes, the lower support pattern including a plurality of first openings, each of which extends to the outer side surface of at least one bottom electrode in the first row of the plurality of bottom electrodes and extends to the outer side surface of at least one bottom electrode in the second row of the plurality of bottom electrodes;

an upper support pattern disposed at a top portion of the plurality of bottom electrodes and contacting the outer side surface of each bottom electrode of the plurality of bottom electrodes, an upper surface of the upper support pattern being positioned at a higher level than the upper surface of each bottom electrode of the plurality of bottom electrodes, the upper support pattern including a plurality of second openings, each of which extends to the outer side surface of at least one bottom electrode in the first row of the plurality of bottom electrodes and extends to the outer side surface of at least one bottom electrode in the second row of the plurality of bottom electrodes, wherein each of the plurality of first openings vertically overlaps a corresponding second opening among the plurality of second openings;

a dielectric layer covering upper and lower surfaces of the lower support pattern and upper and lower surfaces of the upper support pattern, and continuously extending along the outer side surface, the inner side surface, and the upper surface of each bottom electrode of the plurality of bottom electrodes and a side surface of the upper support pattern; and

a top electrode covering the dielectric layer,

wherein a first set of openings, including a first opening among the plurality of first openings and a second opening of the plurality of second openings and corresponding to the first opening, extends to outer side surfaces of an odd number of bottom electrodes among the plurality of bottom electrodes, and thereby the first set of openings extend to the odd number of bottom electrodes,

wherein the upper support pattern has a thickness greater than that of the lower support pattern, and

wherein the odd number of bottom electrodes include at least three bottom electrodes, and an even number of bottom electrodes in the first row of the plurality of bottom electrodes are at least partially disposed within the first set of openings and an odd number of bottom electrodes including at least one electrode in the second row of the plurality of bottom electrodes is at least partially disposed within the first set of openings.

11. The capacitor structure of claim 10 , wherein the plurality of first openings and the plurality of second openings are arranged periodically in both row and column direction respectively, and

wherein at least one bottom electrode of the plurality of bottom electrodes is disposed to penetrate the lower support pattern between two first openings of the plurality of first openings and to penetrate the upper support pattern between two second openings of the plurality of second openings and is surrounded by the lower support pattern and the upper support pattern respectively.

12. The capacitor structure of claim 10 , wherein the plurality of first openings and the plurality of second openings are arranged periodically in diagonal direction respectively, and

wherein at least one bottom electrode of the plurality of bottom electrodes is disposed to penetrate the lower support pattern between two first openings of the plurality of first openings and to penetrate the upper support pattern between two second openings of the plurality of second openings and is surrounded by the lower support pattern and the upper support pattern respectively.

13. The capacitor structure of claim 10 , wherein at least one of the plurality of first openings and the plurality of second openings is round shaped.

14. The capacitor structure of claim 10 , wherein a portion of a sidewall of the upper support pattern extends above the upper surface of each bottom electrode of the plurality of bottom electrodes.

15. The capacitor structure of claim 10 , wherein the plurality of first openings of the lower support pattern are vertically aligned with the plurality of second openings of the upper support pattern, and each of the plurality of first openings and the plurality of second openings is filled with the top electrode.

16. The capacitor structure of claim 15 , wherein an inner space formed in the cylindrical structure of each bottom electrode is filled with the top electrode.

17. The capacitor structure of claim 10 , wherein the inner side surface, the outer side surface, and the upper surface of each bottom electrode, excepting the portion contacting the lower support pattern and the upper support pattern, are covered with the dielectric layer.

18. The capacitor structure of claim 10 , wherein each bottom electrode of the plurality of bottom electrodes penetrates the upper support pattern and the lower support pattern respectively.

19. The capacitor structure of claim 10 , wherein each bottom electrode of the plurality of bottom electrodes is electrically connected to a drain region of metal-oxide-semiconductor (MOS) transistor through a buried contact.