IP Library Granted Patent US 10,751,852
Granted Patent B2
US 10,751,852 · App. 15/899,770 · Granted Aug 25, 2020

Surface grinding method and surface grinding device

Inventors: Takahiro Hasegawa (Osaka, JP); Yoshihiro Kurioka (Osaka, JP); Kazuhiro Yuso (Osaka, JP)
Assignee: KOYO MACHINE INDUSTRIES CO., LTD.
B24B49/186B24B7/228B24B53/02
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Quick Facts
Patent No.
US 10,751,852
App. No.
15/899,770
Granted
Aug 25, 2020
Kind
B2
Abstract

In a surface grinding method in which a grinding wheel is dressed with a dressing board on a chuck table by advancing the grinding wheel from a dressing start position and a workpiece on the chuck table is ground by advancing the grinding wheel, the dressing start position is calculated by measuring a thickness of the dressing board and a thickness of the grinding wheel, and the grinding start position is calculated by measuring the thickness of the grinding wheel after the dressing of the grinding wheel with the dressing board.

Claims (20)

1. A surface grinding method, the method comprising:

dressing a grinding wheel with a dressing board on a chuck table by advancing the grinding wheel from a dressing start position;

grinding a workpiece on the chuck table by advancing the grinding wheel after the dressing of the grinding wheel with the dressing board;

calculating the dressing start position by measuring a thickness of the dressing board and a thickness of the grinding wheel; and

calculating the grinding start position by measuring the thickness of the grinding wheel after the dressing of the grinding wheel with the dressing board.

2. The surface grinding method according to claim 1 , wherein in the calculating the dressing start position, the dressing start position is calculated based on the thickness of the grinding wheel, the thickness of the dressing board and a dressing feeding amount, and

in the calculating the grinding start position, the grinding start position is calculated based on the thickness of the grinding wheel, the finish thickness of the workpiece and a grinding feeding amount.

3. The surface grinding method according to claim 1 , wherein the thickness of the grinding wheel is calculated based on a leading surface position of the grinding wheel and a grinding wheel mounting surface position of a grinding wheel spindle.

4. The surface grinding method according to claim 1 , wherein the dressing start position and the grinding start position are automatically updated after a dressing cycle of the grinding wheel is finished and the leading surface position of the grinding wheel is measured.

5. The surface grinding method according to claim 1 , wherein a reference distance between a chuck surface of the chuck table and the grinding wheel mounting surface of the grinding wheel spindle at an origin position is calculated after the chuck surface is self-ground, and

the dressing start position and the grinding start position are calculated based on the reference distance.

6. The surface grinding method according to claim 1 , wherein the leading surface position of the grinding wheel or the grinding wheel mounting surface position is calculated from a feeding amount of the grinding wheel spindle when the grinding wheel spindle is advanced and a position detection unit detects the leading surface of the grinding wheel or the grinding wheel mounting surface.

7. The surface grinding method according to claim 1 , wherein the thickness of the dressing board is measured from a height of a top surface of a dressing board placing table and a height of a top surface of the dressing board on the dressing board placing table.

8. The surface grinding method according to claim 1 , wherein the grinding wheel is fed by a preset amount from a point that a rotation load of the grinding wheel increases when the grinding wheel is dressed.

9. A surface grinding machine in which a grinding wheel mounted on a grinding wheel mounting surface of a grinding wheel spindle is dressed with a dressing board on a chuck table by advancing the grinding wheel from a dressing start position, and a workpiece on the chuck table is ground by advancing the grinding wheel from a grinding start position, the surface grinding machine comprising:

a dressing board placing table on which the dressing board is placed;

a height measuring unit configured to measure a height of a top surface of the dressing board placing table and a height of a top surface of the dressing board on the dressing board placing table;

a position detection unit configured to detect a position of the grinding wheel mounting surface and a position of a leading surface of the grinding wheel;

a dressing start position calculation unit configured to calculate the dressing start position based on the height of the top surface of the dressing board placing table and the height of the top surface of the dressing board; and

a grinding start position calculation unit configured to calculate the grinding start position based on the position of the grinding wheel mounting surface and the position of the leading surface of the grinding wheel.

Assignments (2)
CHANGE OF NAME Recorded Mar 17, 2023
From: KOYO MACHINE INDUSTRIES CO., LTD.
To: JTEKT MACHINE SYSTEMS CORPORATION
Reel/Frame 063116/0520 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2018
From: HASEGAWA, TAKAHIRO; KURIOKA, YOSHIHIRO; YUSO, KAZUHIRO
To: KOYO MACHINE INDUSTRIES CO., LTD.
Reel/Frame 044975/0382 →
Priority Claims (1)
JP 2017-047149 · Mar 13, 2017 · national
Continuity (1)
Related Publication 20180257195A1 · Sep 13, 2018