Semiconductor structure and method of manufacturing the same
A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate having a front surface and a back surface facing opposite to the front surface; a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate, the filling material including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and an epitaxial layer lined between the lower portion of the filling material and the semiconductor substrate. An associated manufacturing method is also disclosed.
1. A semiconductor structure, comprising:
a semiconductor substrate having a front surface and a back surface facing opposite to the front surface;
a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate, the filling material including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and
a region having graded transition of doping concentration in the semiconductor substrate encompassing the lower portion of the filling material and free from abutting the upper portion of the filling material, the region includes an epitaxial layer lined encompassing the lower portion of the filling material.
2. The semiconductor structure of claim 1 , wherein the epitaxial layer comprises boron, and the region further includes graded transition of boron doping concentration in the semiconductor substrate abutting the epitaxial layer.
3. The semiconductor structure of claim 1 , wherein an aspect ratio of a cross-sectional view of the filling material is in a range of about 20 to about 100.
4. The semiconductor structure of claim 1 , wherein a ratio of a depth of the filling material to a depth of the upper portion of the filling material is in a range of about 10 to about 70.
5. The semiconductor structure of claim 1 , wherein the upper portion of the filling material includes a first filling material, and the lower portion of the filling material includes a second filling material different from the first filling material.
6. The semiconductor structure of claim 5 , wherein the first filling material includes oxide, and the second filling material includes polysilicon.
7. The semiconductor structure of claim 1 , wherein the upper portion of the filling material includes a first filling material, and the lower portion of the filling material includes a second filling material substantially the same to the first filling material.
8. The semiconductor structure of claim 7 , wherein the first filling material and the second filling material include oxide.
9. The semiconductor structure of claim 1 , wherein the semiconductor structure further comprises:
a first photosensitive region and a second photosensitive region formed in the semiconductor substrate abutting the front surface;
a micro-lenses over the front surface; and
an interconnect structure over the front surface between the micro-lenses and the front surface;
wherein the filling material is between the first photosensitive region and the second photosensitive region.
10. A semiconductor structure, comprising:
a semiconductor substrate having a first surface and a second surface facing opposite to the first surface;
an isolation structure extending from the first surface into the semiconductor substrate without penetrating through the semiconductor substrate, the isolation structure including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and
a region having graded transition of doping concentration in the semiconductor substrate encompassing the lower portion of the isolation structure and free from abutting the upper portion of the isolation structure.
11. The semiconductor structure of claim 10 , wherein the region has graded transition of boron doping concentration.
12. The semiconductor structure of claim 10 , wherein an aspect ratio of a cross-sectional view of the isolation structure is in a range of about 20 to about 100.
13. The semiconductor structure of claim 10 , wherein a ratio of a depth of a bottom of the isolation structure to a depth of a bottom of the upper portion of the isolation structure is in a range of about 10 to about 70.
14. The semiconductor structure of claim 10 , wherein the upper portion of the isolation structure includes a first material, and the lower portion of the isolation structure includes a second material different from the first material.
15. The semiconductor structure of claim 14 , wherein the first material includes oxide, and the second material includes polysilicon.
16. The semiconductor structure of claim 10 , wherein the upper portion of the isolation structure includes a first material, and the lower portion of the isolation structure includes a second material substantially the same to the first material.
17. The semiconductor structure of claim 16 , wherein the first material and the second material include oxide.
18. A semiconductor structure, comprising:
a semiconductor substrate having a front surface and a back surface facing opposite to the front surface;
a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate;
a doped epitaxial layer at least lined between a bottom of the filling material and the semiconductor substrate; and
a region having graded transition of doping concentration in the semiconductor substrate encompassing the epitaxial layer;
wherein the doped epitaxial layer and the region together form a region having graded transition of doping concentration in the semiconductor substrate encompassing a lower portion of the filling material and free from abutting an upper portion of the filling material.
19. The semiconductor structure of claim 18 , wherein the doped epitaxial layer comprises boron.
20. The semiconductor structure of claim 18 , wherein an aspect ratio of a cross-sectional view of the filling material is in a range of about 20 to about 100.