IP Library Granted Patent US 10,475,587
Granted Patent B2
US 10,475,587 · App. 15/903,976 · Granted Nov 12, 2019

Feedthrough capacitor

Inventors: Toru Onoue (Tokyo, JP); Daisuke Himeta (Tokyo, JP); Hikaru Hirabayashi (Tokyo, JP); Fumiaki Satoh (Tokyo, JP); Yuma Hattori (Tokyo, JP); Takuto Okamoto (Tokyo, JP)
Assignee: TDK CORPORATION
H01G4/35H01G4/30
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Quick Facts
Patent No.
US 10,475,587
App. No.
15/903,976
Granted
Nov 12, 2019
Kind
B2
Abstract

A first external electrode is disposed on an end surface. A second external electrode is disposed on a side surface. The first external electrode includes a first sintered electrode layer, a second sintered electrode layer disposed on the first sintered electrode layer, and a plated layer disposed on the second sintered electrode layer. The second external electrode includes a third sintered electrode layer and a plated layer disposed on the third sintered electrode layer. The first, second, and third sintered electrode layers include a void. A void fraction of each of the first and third sintered electrode layers is larger than a void fraction of the second sintered electrode layer.

Claims (40)

1. A feedthrough capacitor comprising:

an element body including a pair of end surfaces opposing each other, and at least one side surface located between the pair of end surfaces;

a pair of first external electrodes disposed on the pair of end surfaces, respectively;

a second external electrode spaced apart from the pair of first external electrodes and disposed on the side surface;

a first internal electrode disposed in the element body and including a pair of first portions exposed to the pair of end surfaces; and

a second internal electrode disposed in the element body to oppose the first internal electrode and including a second portion exposed to the side surface, wherein

each of the first external electrodes includes:

a first sintered electrode layer covering the corresponding first portion and being connected to the corresponding first portion;

a second sintered electrode layer disposed on the first sintered electrode layer; and

a plated layer disposed on the second sintered electrode layer,

the second external electrode includes:

a third sintered electrode layer covering the second portion and being connected to the second portion; and

a plated layer disposed on the third sintered electrode layer,

the first, second, and third sintered electrode layers include a void,

a void fraction of each of the first and third sintered electrode layers is larger than a void fraction of the second sintered electrode layer,

the void fraction of each of the first and third sintered electrode layers is 0.2 to 1.0%, and

the void fraction of the second sintered electrode layer is 0.02 to 0.18%.

2. The feedthrough capacitor according to claim 1 , wherein

a width of the second portion is smaller than a width of each of the first portions.

3. A feedthrough capacitor comprising:

an element body including a pair of end surfaces opposing each other, and at least one side surface located between the pair of end surfaces;

a pair of first external electrodes disposed on the pair of end surfaces, respectively;

a second external electrode spaced apart from the pair of first external electrodes and disposed on the side surface;

a first internal electrode disposed in the element body and including a pair of first portions exposed to the pair of end surfaces; and

a second internal electrode disposed in the element body to oppose the first internal electrode and including a second portion exposed to the side surface, wherein

each of the first external electrodes includes:

a first sintered electrode layer covering the corresponding first portion and being connected to the corresponding first portion;

a second sintered electrode layer disposed on the first sintered electrode layer; and

a plated layer disposed on the second sintered electrode layer,

the second external electrode includes:

a third sintered electrode layer covering the second portion and being connected to the second portion; and

a plated layer disposed on the third sintered electrode layer,

the first, second, and third sintered electrode layers include a void,

a void fraction of each of the first and third sintered electrode layers is larger than a void fraction of the second sintered electrode layer,

each of the first external electrodes includes a first conductor portion located on the corresponding the end surface,

the second external electrode includes a second conductor portion located on the side surface,

a surface area of the second conductor portion is smaller than a surface area of the first conductor portion, and

a surface roughness of the second conductor portion is larger than a surface roughness of the first conductor portion.

4. The feedthrough capacitor according to claim 3 , wherein

a width of the second portion is smaller than a width of each of the first portions.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2018
From: ONOUE, TORU; HIMETA, DAISUKE; HIRABAYASHI, HIKARU; SATOH, FUMIAKI; HATTORI, YUMA; OKAMOTO, TAKUTO
To: TDK CORPORATION
Reel/Frame 045023/0457 →
Priority Claims (1)
JP 2017-065398 · Mar 29, 2017 · national
Continuity (1)
Related Publication 20180286583A1 · Oct 4, 2018