Reflection type exposure mask and pattern forming method

1. A pattern forming method comprising:

forming a photosensitive film on a substrate, wherein the substrate includes a first region, a second region, and a third region provided between the first and second regions to cause a step to be formed on a surface of the photosensitive film prior to forming an image of a predetermined pattern on the photosensitive film;

forming the image of the predetermined pattern on the photosensitive film by condensing reflected light of exposure light with which a reflection type exposure mask is irradiated; and

transferring the pattern to the photosensitive film,

wherein

the reflection type exposure mask comprises:

a reflective layer that reflects the exposure light, and

a light absorption layer that is provided on a surface of the reflective layer and absorbs the exposure light,

the light absorption layer comprises:

a first light absorption portion which extends in a first direction along the surface of the reflective layer and causes a first image to be formed in the first region, and

a second light absorption portion which extends in the first direction and causes a second image to be formed in the second region, and

a thickness of the first light absorption portion in a direction which is perpendicular to the surface of the reflective layer is thinner than a thickness of the second light absorption portion in the direction which is perpendicular to the surface of the reflective layer.

2. The pattern forming method according to claim 1 ,

wherein a difference between the thickness of the first light absorption portion and the thickness of the second light absorption portion is based on a height of the step.

3. The pattern forming method according to claim 2 ,

wherein the difference between the thickness of the first light absorption portion and the thickness of the second light absorption portion is equal to a height of the step.

4. The pattern forming method according to claim 1 ,

wherein the first image and the second image are formed at best focus positions in the photosensitive film, respectively.

5. The pattern forming method according to claim 1 ,

wherein

the light absorption layer further includes a third light absorption portion which causes a third image to be formed in the third region, and

the third image is formed in a light condensing condition in which a focus position in a direction which is perpendicular to a surface of a region of the photosensitive film other than the third region gradually changes in a direction from the first region toward the second region.

6. The pattern forming method according to claim 1 ,

wherein the light absorption layer is located between the first region and the second region,

the light absorption layer further includes a third light absorption portion which causes a third image to be formed in the third region, the third light absorption portion having a stepped shape extending between the first light absorption portion and the second light absorption portion, the third light absorption portion having a thickest step in a portion closest to the first light absorption portion, and a thinnest step in a portion closest to the first light absorption portion.

7. The pattern forming method according to claim 6 , wherein the thickest step has a same height as the first light absorption portion, and the thinnest step has a same height as the second light absorption portion.

8. A pattern forming method comprising:

forming a photosensitive film on a substrate, wherein the substrate includes a first region, a second region, and a third region provided between the first and second regions to cause a step to be formed on a surface of the photosensitive film prior to forming an image of a predetermined pattern on the photosensitive film;

forming the image of the predetermined pattern on the photosensitive film by condensing reflected light of exposure light with which a reflection type exposure mask is irradiated; and

transferring the pattern to the photosensitive film,

wherein

the reflection type exposure mask comprises:

a reflective layer that reflects the exposure light, and

a light absorption layer that is provided on a surface of the reflective layer and absorbs the exposure light,

the light absorption layer comprises:

a first light absorption portion which extends in a first direction along the surface of the reflective layer and causes a first image to be formed in the first region, and

a second light absorption portion which extends in a second direction, which intersects with the first direction, and causes a second image to be formed in the second region, and

a thickness of the first light absorption portion in a direction which is perpendicular to the surface of the reflective layer is different than a thickness of the second light absorption portion in the direction which is perpendicular to the surface of the reflective layer.

9. The pattern forming method according to claim 8 ,

wherein the difference between the thickness of the first light absorption portion and the thickness of the second light absorption portion is based on, from a top view, the relative direction of exposure light incident on the mask and the first direction and the relative direction of exposure light incident on the mask and the second direction.

10. The pattern forming method according to claim 9 ,

wherein, from a top view, the direction of exposure light incident on the mask is perpendicular to the first direction and the direction of exposure light incident on the mask is parallel to the second direction.