Package and electronic apparatus including a package having a microlens layer and color filter layer
Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
1. A package comprising:
a semiconductor substrate;
a color filter layer at a light-incident side of the semiconductor substrate;
a transparent substrate;
an effective pixel region including a plurality of photoelectric conversion regions located in the semiconductor substrate and a microlens layer, wherein the microlens layer is between the color filter layer and the transparent substrate;
an end portion;
a transition region including the color filter layer and located between the effective pixel region and the end portion; and
an organic material layer between the color filter layer and the transparent substrate, wherein the organic material layer extends from the transition region to the end portion,
wherein,
the end portion is between an outer edge of the package and the transition region, and
an edge of the transparent substrate is coincident with the outer edge of the package.
2. The package according to claim 1 , further comprising:
a silicon oxide film located at the light-incident side of the semiconductor substrate.
3. The package according to claim 2 , further comprising:
a light-shielding film located above the silicon oxide film.
4. The package according to claim 1 , further comprising:
another organic material layer located above the color filter layer.
5. The package according to claim 1 , further comprising:
a support substrate at a side of the semiconductor substrate that is opposite to the light-incident side of the semiconductor substrate.
6. The package according to claim 5 , further comprising:
a wiring layer between the semiconductor substrate and the support substrate.
7. The package according to claim 1 , wherein the transparent substrate is cover glass.
8. The package according to claim 1 , wherein the package is a chip-size package.
9. The package according to claim 1 , wherein the package is a cavityless chip-size package.
10. The package according to claim 1 , further comprising:
a flat film included in the end portion and formed of a same material as the microlens layer.
11. An electric apparatus comprising:
a lens;
a signal processing circuit; and
a package including:
a semiconductor substrate;
a color filter layer at a light-incident side of the semiconductor substrate;
a transparent substrate;
an effective pixel region including a plurality of photoelectric conversion regions located in the semiconductor substrate and a microlens layer, wherein the microlens layer is between the color filter layer and the transparent substrate;
an end portion;
a transition region including the color filter layer and located between the effective pixel region and the end portion; and
an organic material layer between the color filter layer and the transparent substrate, wherein the organic material layer extends from the transition region to the end portion,
wherein,
the end portion is between an outer edge of the package and the transition region, and
an edge of the transparent substrate is coincident with the outer edge of the package.
12. The electronic apparatus according to claim 11 , further comprising:
a silicon oxide film located at the light-incident side of the semiconductor substrate.
13. The electronic apparatus according to claim 12 , further comprising:
a light-shielding film located above the silicon oxide film.
14. The electronic apparatus according to claim 11 , further comprising:
another organic material layer located above the color filter layer.
15. The electronic apparatus according to claim 11 , further comprising:
a support substrate at a side of the semiconductor substrate that is opposite to the light-incident side of the semiconductor substrate.
16. The electronic apparatus according to claim 15 , further comprising:
a wiring layer between the semiconductor substrate and the support substrate.
17. The electronic apparatus according to claim 11 , wherein the transparent substrate is cover glass.
18. The electronic apparatus according to claim 11 , wherein the package is a chip-size package.
19. The electronic apparatus according to claim 11 , wherein the package is a cavityless chip-size package.
20. The electronic apparatus according to claim 11 , further comprising:
a flat film included in the end portion and formed of a same material as the microlens layer.