Semiconductor device structure and method for forming the same

1. A method for forming a semiconductor device structure, comprising:

forming a metal gate electrode structure and an insulating layer over a semiconductor substrate, wherein the insulating layer surrounds the metal gate electrode structure; and

nitrifying a first top portion of the metal gate electrode structure to transform the first top portion into a metal nitride layer while nitrifying a second top portion of the insulating layer to transform the second top portion of the insulating layer to a dielectric nitride layer.

2. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the nitrification of the first top portion and the second top portion comprises:

performing a nitrogen plasma process or a nitrogen ion implantation process.

3. The method for forming a semiconductor device structure as claimed in claim 2 , wherein the nitrification further comprises:

after the nitrogen plasma process or the nitrogen ion implantation process, performing a thermal process.

4. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising:

before the nitrification of the first top portion and the second top portion, removing a third top portion of the insulating layer to expose an upper portion of a sidewall of the metal gate electrode structure, wherein the exposed upper portion of the sidewall is a work function metal.

5. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising:

recessing the metal gate electrode structure before the nitrification;

wherein the recessing includes exposing a sidewall of a spacer element abutting the metal gate electrode.

6. The method of claim 1 , where the metal gate electrode has a first composition having a first upper surface prior to the nitrifying and wherein after the nitrifying the first composition has a second upper surface lower than the first upper surface, the second upper surface interfacing the metal nitride layer.

7. The method of forming a semiconductor device structure as claimed in claim 1 , further comprising:

depositing an etch stop layer over the metal nitride layer.

8. The method of forming a semiconductor device structure as claimed in claim 7 , further comprising:

etching the etch stop layer to form contact openings.

9. The method of forming a semiconductor device structure as claimed in claim 8 , wherein the contact openings extend through nitrified second top portion of the insulating layer.

10. A method of fabricating a semiconductor device structure, comprising:

forming a metal gate structure over a semiconductor substrate, wherein the forming the metal gate structure includes forming a first conductive layer and a second conductive layer;

disposing an insulating layer over the semiconductor substrate and surrounding the metal gate structure; and

performing a nitrification process on the metal gate structure, wherein the nitrification process introduces nitrogen into an upper portion of the metal gate structure such that the nitrogen combines with a first composition to form a first metal nitride layer over a top surface of the first conductive layer of the first composition and the nitrogen combines with a second composition of the upper portion of the metal gate structure to form a second metal nitride layer over a top surface of the second conductive layer of the second composition, wherein the first composition is different than the second composition.

11. The method of claim 10 wherein the nitrification process forms a nitride layer over the insulating layer by the nitrogen of the nitrification process combining with a dielectric composition of the insulating layer, wherein the nitride layer is a nitride material of the dielectric composition of the insulating layer.

12. The method of claim 10 , wherein the forming the metal gate structure includes:

removing a dummy gate to form an opening in the insulating layer;

depositing the first conductive layer lining sidewalls and a bottom of the opening; and

depositing the second conductive layer over the first conductive layer.

13. The method of claim 12 , wherein the first conductive layer is a work function metal layer having the first composition of one of a n-type or a p-type work function material.

14. The method of claim 13 , wherein the second composition of the second conductive layer includes at least one of aluminum, tungsten, gold, platinum, or cobalt.

15. The method of claim 10 , further comprising: recessing the metal gate structure before performing the nitrification process.

16. The method of claim 10 , further comprising: recessing the insulating layer before performing the nitrification process to expose a sidewall of at least one of the first conductive layer or the second conductive layer of the metal gate structure.

17. A method for forming a semiconductor device structure, comprising:

forming a metal gate structure and an insulating layer over a semiconductor substrate, wherein the insulating layer surrounds the metal gate structure;

removing a top portion of the insulating layer to expose a portion of sidewalls of the metal gate structure; and

nitrifying a first top portion of the metal gate structure to implant nitrogen into the first top portion of the metal gate structure converting the first top portion to a metal nitride layer wherein the implanting the nitrogen includes converting the exposed portion of the sidewalls of the metal gate structure to the metal nitride layer.

18. The method of claim 17 , wherein the removing the top portion of the insulating layer includes removing portions of a spacer layer.

19. The method of claim 17 , wherein the nitrifying the portion of the sidewalls of the metal gate structure includes nitrifying a work function metal layer to form the metal nitride layer.

20. The method of claim 17 , wherein the nitrifying further includes nitrifying a top surface of the insulating layer.