Semiconductor device including an electrode having a part with an inverse tapered shape
A semiconductor device according to an embodiment includes a semiconductor layer having a first plane and a second plane; a first and a second electrode; first, second, and third semiconductor regions; first and second gate electrodes in the semiconductor layer; first and second gate insulating films; and an insulating layer provided between the first and second gate electrodes and the first electrode. The first electrode has a first region and a second region. The first region contacts the semiconductor layer. The first region is located between the second region and the first semiconductor region. A first part of the first region is located between the first gate electrode and the second gate electrode. A second part of the first region is interposed between a first portion and a second portion of the insulating layer. The second part of the first region has an inverse tapered shape.
1. A semiconductor device comprising:
a semiconductor layer having a first plane and a second plane opposite to the first plane;
a first electrode contacting the first plane, the first electrode including a first region and a second region;
a second electrode contacting the second plane;
a first semiconductor region of a first conductivity type provided in the semiconductor layer;
a second semiconductor region of a second conductivity type provided in the semiconductor layer, the second semiconductor region being located between the first semiconductor region and the second plane;
a third semiconductor region of the second conductivity type provided in the semiconductor layer, the third semiconductor region being located between the first semiconductor region and the first plane;
a first gate electrode provided in the semiconductor layer;
a second gate electrode provided in the semiconductor layer, the first semiconductor region being located between the second gate electrode and the first gate electrode;
a first gate insulating film provided between the first gate electrode and the first semiconductor region;
a second gate insulating film provided between the second gate electrode and the first semiconductor region; and
an insulating layer including a first portion and a second portion, the first portion provided between the first gate electrode and the first electrode, and the second portion provided between the second gate electrode and the first electrode, wherein
the first region contacts the semiconductor layer,
the first region is located between the second region and the first semiconductor region,
a first part of the first region is located between the first gate electrode and the second gate electrode,
a second part of the first region is interposed between the first portion and the second portion, and
the second part of the first region has an inverse tapered shape.
2. The semiconductor device according to claim 1 , wherein
an angle formed between the first plane and a boundary between the first portion of the insulating layer and the first region is equal to or greater than 85 degrees and less than 90 degrees, and
an angle formed between the first plane and a boundary between the second portion of the insulating layer and the first region is equal to or greater than 85 degrees and less than 90 degrees.
3. The semiconductor device according to claim 1 , wherein
an angle formed between the first plane and a boundary between the first portion of the insulating layer and the first region is equal to or greater than 85 degrees and equal to or less than 89 degrees, and
an angle formed between the first plane and a boundary between the second portion of the insulating layer and the first region is equal to or greater than 85 degrees and equal to or less than 89 degrees.
4. The semiconductor device according to claim 1 , further comprising:
a fourth semiconductor region of the first conductivity type provided in the semiconductor layer, the fourth semiconductor region being located between the first region and the first semiconductor region, a first-conductivity-type impurity concentration of the fourth semiconductor region being higher than a first-conductivity-type impurity concentration of the first semiconductor region.
5. The semiconductor device according to claim 1 , wherein the insulating layer includes silicon oxide.
6. The semiconductor device according to claim 1 , wherein the semiconductor layer is made of silicon.