Polishing device, polishing method, and record medium

1. A polishing device which polishes a surface of a polishing target, the device comprising:

a sensor configured to sense a characteristic value correlated with a state of the surface during polishing;

an end point detector configured to detect that the characteristic value or a polishing time satisfies an end point condition corresponding to an end point of the polishing; and

an end point condition setter configured to set the end point condition in accordance with a functional expression using at least one of device information about the polishing device and polishing target information about the polishing target as a parameter and to output the set end point condition to the end point detector,

wherein the end point condition is the threshold, the maximum time, an elapsed time from detection of the threshold, an average section for smoothing a current waveform including noise, a section for calculating the gradient of a current waveform, and the average section of the gradient, a detection condition of detecting a decrease start point or an increase start point of the waveform of the characteristic value.

2. The polishing device according to claim 1 , further comprising:

a polishing pad to polish the surface; and

a dresser to grind the polishing pad, wherein

a use state of the polishing pad, a use state of the dresser, or a grinding rate of the polishing pad is inputted as the device information to the end point condition setter.

3. The polishing device according to claim 1 , wherein the characteristic value or the polishing time detected so far by the end point detector is inputted as the device information to the end point condition setter.

4. The polishing device according to claim 1 , wherein at least one of a film thickness, a surface step, a warp amount, and a pattern length of the polishing target is measured in advance, and the measured value is inputted as the polishing target information to the end point condition setter.

5. The polishing device according to claim 1 , wherein history information indicating a polishing history of the polishing device is inputted as the device information to the end point condition setter.

6. The polishing device according to claim 1 , further comprising:

a polishing pad to polish the surface;

a polishing table provided with the polishing pad; and

a table drive mechanism to drive the polishing table, wherein

the sensor senses, as the characteristic value, drive current of the table drive mechanism.

7. The polishing device according to claim 1 , further comprising

a light source to irradiate the surface with light during polishing, wherein

the sensor senses, as the characteristic value, an optical value concerning reflection light of the light reflected by the surface, and

the end point condition setter sets the end point condition in accordance with the device information indicating a cumulative use time of the light source.

8. The polishing device according to claim 1 , a history of the polishing target polished so far by the polishing device is inputted as the device information to the end point condition setter.

9. The polishing device according to claim 1 , wherein information about a design layout on the surface of the polishing target is inputted as the polishing target information to the end point condition setter.

10. A polishing method comprising:

automatically setting an end point condition which corresponds to an end point of polishing performed by the polishing device, in accordance with a functional expression using at least one of device information about a polishing device and polishing target information about the polishing target as a parameter;

polishing the surface of the polishing target with the polishing device;

sensing the characteristic value correlated with the state of the surface during the polishing; and

ending the polishing when detecting that the characteristic value satisfies the end point condition,

wherein the end point condition is the threshold, the maximum time, an elapsed time from detection of the threshold, an average section for smoothing a current waveform including noise, a section for calculating the gradient of a current waveform, and the average section of the gradient, a detection condition of detecting a decrease start point or an increase start point of the waveform of the characteristic value.

11. A non-transitory record medium recording a program to be executed by a computer which is connected to a polishing device including a sensor to sense a characteristic value correlated with a state of a surface of a polishing target during polishing of the surface and including an end point detector to detect that the characteristic value satisfies an end point condition corresponding to an end point of the polishing, the program comprising:

automatically setting the end point condition in accordance with a functional expression using at least one of device information about the polishing device and polishing target information about the polishing target as a parameter, and

outputting the set the end point condition to the end point detector,

wherein the end point condition is the threshold, the maximum time, an elapsed time from detection of the threshold, an average section for smoothing a current waveform including noise, a section for calculating the gradient of a current waveform, and the average section of the gradient, a detection condition of detecting a decrease start point or an increase start point of the waveform of the characteristic value.

12. The polishing device according to claim 1 , wherein

the end point condition setter includes a calculation processor including a CPU (central processing unit) that operates in accordance with a predetermined program, and a storage including a semiconductor memory having the program, and

the calculation processor sets a threshold or a maximum polishing time according to a polishing form, and

the calculation processor determines the end point condition in accordance with at least one of the device information and the polishing target information.