Method of manufacturing a flexible organic light-emitting diode (OLED) display panel by laser lift-off of a glass carrier through a planarization layer
A method of manufacturing flexible OLED display panel is provided. The method comprises following steps. Providing a glass carrier, sequentially forming a flexible substrate, a low temperature poly-Si layer and OLED element layer on a surface of the glass carrier; forming a planar layer on a second surface of the glass carrier which is away from the flexible substrate and obtaining a planning OLED display panel; removing the glass carrier by laser lift-off the planning OLED display panel and obtaining the flexible OLED display panel. The method could reduce the problem of lower peeling successful rate caused by the unevenly distributing in the flexible substrate during the laser lift-off process.
1. A method of manufacturing a flexible OLED display panel, comprising
providing a glass carrier, sequentially forming a flexible substrate, a low temperature poly-Si layer and an OLED element layer on a surface of the glass carrier;
forming a planarization layer on a second surface of the glass carrier which is away from the flexible substrate and obtaining a planarized OLED display panel;
removing the glass carrier by laser lift-off the planarized OLED display panel, and obtaining the flexible OLED display panel;
sequentially forming a packaging protecting layer, a flexible rear cover on the OLED element layer, the flexible substrate and the flexible rear cover forming an enclosed space for accommodating the OLED element layer and the packaging protecting layer; and
forming a touch wire on the flexible substrate; or forming a first blocking layer on the flexible substrate, and forming the touch wire on the first blocking layer.
2. The method of manufacturing a flexible OLED display panel according to claim 1 , wherein the planarization layer has laser transmittance ≥90% in 300-400 nm wavelength range.
3. The method of manufacturing a flexible OLED display panel according to claim 2 , wherein the material of the planarization layer has laser absorption rate ≤6% in 300-400 nm wavelength range.
4. The method of manufacturing a flexible OLED display panel according to claim 3 , wherein the roughness of the planarization layer is 0.05-0.3 μm.
5. The method of manufacturing a flexible OLED display panel according to claim 4 , wherein the material of the planarization layer comprises at least one of organic material or inorganic material, the organic material comprises at least one of epoxy, acrylic resin and silicone; the inorganic material comprises at least one of silicon dioxide, magnesium fluoride, calcium fluoride and barium fluoride.
6. The method of manufacturing a flexible OLED display panel according to claim 3 , wherein the material of the planarization layer comprises at least one of organic material or inorganic material, the organic material comprises at least one of epoxy, acrylic resin and silicone; the inorganic material comprises at least one of silicon dioxide, magnesium fluoride, calcium fluoride and barium fluoride.
7. The method of manufacturing a flexible OLED display panel according to claim 1 , wherein the roughness of the planarization layer is Ra≤0.4 μm.
8. The method of manufacturing a flexible OLED display panel according to claim 1 , wherein the thickness of the planarization layer is 50-120 μm.
9. The method of manufacturing a flexible OLED display panel according to claim 8 , wherein the thickness of the glass carrier is 400-500 μm.
10. The method of manufacturing a flexible OLED display panel according to claim 9 , wherein the planarization layer and the glass carrier which are stacking positioned have laser transmittance ≥40% in 300-400 nm wavelength range.
11. The method of manufacturing a flexible OLED display panel according to claim 10 , wherein the material of the planarization layer comprises at least one of organic material or inorganic material, the organic material comprises at least one of epoxy, acrylic resin and silicone; the inorganic material comprises at least one of silicon dioxide, magnesium fluoride, calcium fluoride and barium fluoride.
12. The method of manufacturing a flexible OLED display panel according to claim 11 , wherein the material of the planarization layer is silicon dioxide.
13. The method of manufacturing a flexible OLED display panel according to claim 11 , wherein the step of forming the planarization layer which is mixing the material of the planarization layer and a solvent to obtain a sizing mixture; coating the sizing mixture on the second surface of the glass carrier which is away from the flexible substrate; and curing to form the planarization layer.
14. The method of manufacturing a flexible OLED display panel according to claim 1 , wherein the material of the planarization layer comprises at least one of organic material or inorganic material, the organic material comprises at least one of epoxy, acrylic resin and silicone; the inorganic material comprises at least one of silicon dioxide, magnesium fluoride, calcium fluoride and barium fluoride.
15. The method of manufacturing a flexible OLED display panel according to claim 14 , wherein the step of forming the planarization layer which is mixing the material of the planarization layer and a solvent to obtain a sizing mixture; coating the sizing mixture on the second surface of the glass carrier which is away from the flexible substrate; and curing to form the planarization layer.
16. The method of manufacturing a flexible OLED display panel according to claim 1 , wherein during the laser lift-off, the laser wavelength is 300-400 nm; the laser energy is 290-350 mJ.
17. The method of manufacturing a flexible OLED display panel according to claim 1 , wherein the packaging protecting layer encapsulating the OLED element and the low temperature poly-Si layer on the flexible substrate; the packaging protecting layer is formed by disposing an organic film and an inorganic film alternately.
18. The method of manufacturing a flexible OLED display panel according to claim 1 , further comprising a second blocking layer positioned between the touch wire and the low temperature poly-Si layer.