Semiconductor memory device
View Patent ↗A semiconductor memory device includes a stacked body, a semiconductor member, and a first insulating member. Electrode films and insulating films are alternately stacked along a first direction in the stacked body. An end part of the stacked body is shaped like a staircase in which a terrace is formed for each of the electrode films. A portion of the electrode film placed in the end part is thicker than a portion of the electrode film placed in a central part of the stacked body. The semiconductor member extends in the first direction and penetrates through the central part of the stacked body. The first insulating member extends in the first direction and is provided in the end part.
1. A semiconductor memory device comprising:
a stacked body in which electrode films and insulating films are alternately stacked along a first direction, and an end part of the stacked body in a second direction crossing the first direction being shaped like a staircase in which a terrace is formed for each of the electrode films:
a semiconductor member extending in the first direction and penetrating through a central part in the second direction of the stacked body;
a first insulating member extending in the first direction and penetrating through at least one of the electrode films placed in the end part;
a contact provided on the end part and connected to an electrode film of the electrode films in the terrace;
insulating plates provided on both sides of the stacked body in a third direction, the third direction crossing a plane including the first direction and the second direction,
a charge storage member provided between the semiconductor member and the electrode film,
a first insulating layer provided between the charge storage member and the electrode film; and
a second insulating layer provided between the first insulating layer and the electrode film and being different in composition from the first insulating layer, wherein
the electrode film includes:
a conductive body part; and
a conductive layer covering part of a surface of the conductive body part, and
the conductive layer is placed between the conductive body part and the semiconductor member, not placed between the conductive body part and the first insulating member, also not placed between the conductive body part and the insulating plates, and
the second insulating layer is placed between the conductive body part and the semiconductor member, not placed between the conductive body part and the insulating plate, and also not placed between the conductive body part and the first insulating member; and
wherein a portion of the electrode film placed in the end part is thicker than a portion of the electrode film placed in the central part in the second direction of the stacked body.
2. The semiconductor memory device according to claim 1 , further comprising:
conductive plates provided on both the third direction sides of the stacked body and extending in the second direction, wherein
the insulating plates are placed between the conductive plates and the stacked body.
3. The semiconductor memory device according to claim 1 , wherein a portion of the insulating films placed in the end part is thinner than a portion of the insulating films placed in the central part.
4. The semiconductor memory device according to claim 1 , further comprising:
a second insulating member provided in an upper part of the stacked body and extending in the second direction,
wherein the conductive layer is placed between the conductive body part and the second insulating member.
5. The semiconductor memory device according to claim 1 , wherein the first insulating member is placed in central part in the third direction of the end part.
6. The semiconductor memory device according to claim 1 , wherein the first insulating member is placed intermittently along the second direction.
7. The semiconductor memory device according to claim 1 , wherein the first insulating member is shaped like a column with a longitudinal direction in the first direction.
8. The semiconductor memory device according to claim 1 , wherein the first insulating member extends in the second direction.
9. The semiconductor memory device according to claim 1 , wherein the first insulating member penetrates through the stacked body in the first direction.
10. The semiconductor memory device according to claim 1 , wherein the first insulating member is placed in an upper part of the stacked body.
11. The semiconductor memory device according to claim 10 , wherein the electrode film placed in the upper part of the end part of the stacked body is thicker than the electrode film placed in a lower part of the end part.
12. The semiconductor memory device according to claim 1 , further comprising:
a conductive member provided in the first insulating member.