Flexible circuits and methods therefor
One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second mask—mirrored image of the first mask—to a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.
1. A method for fabricating a component of a flexible circuitry layer, comprising:
applying a first mask to a first side of a textile, wherein the textile includes a layer of metallized material thereon, and wherein the applied first mask does not cover at least a first portion of the first side;
applying a second mask to a second side of the textile, wherein the applied second mask does not cover at least a first portion of the second side, wherein the first portion of the second side is opposite the first portion of the first side; and
applying a chemical to remove at least a portion of the layer of metallized material in the first portion of the first side.
2. The method of claim 1 , further comprising applying a non-conductive hydrophobic coating across the first side of the fabric substrate and the second side of the fabric substrate.
3. The method of claim 1 , wherein, after the chemical is applied, the remaining metallized material comprises circuit traces.
4. The method of claim 1 , further comprising assembling a circuitry layer, including:
attaching an electrical component to the textile; and
attaching a power carrier to the textile.
5. The method of claim 4 , further comprising incorporating the circuitry layer into a soft good product, wherein incorporating the circuitry layer into the soft good product includes:
applying a heat-activated adhesive across the first side of the textile; arranging the circuitry layer across a region of the soft good product; and
applying a heated surface to the second side of the textile to activate the heat-activated adhesive and to adhere the circuitry layer to the soft good product.
6. The method of claim 4 , further comprising incorporating the circuitry layer into a soft good product, wherein incorporating the circuitry layer into the soft good product includes sewing the circuitry layer between an outer layer and a lining of the soft good product with an electrically-insulative thread.
7. The method of claim 1 , further comprising cutting a piece of vinyl.
8. The method of claim 7 , further comprising applying the cut piece of vinyl to the first side of the textile.
9. The method of claim 1 , further comprising removing the first mask.