Screen printing plate and manufacturing method of electronic component
In some embodiments, a screen printing plate 10 includes a metal mesh part 13 and a metal mask part 14 provided on one side of the metal mesh part 13 integrally with the metal mesh part 13 . In addition, the metal mask part 14 has an opening part 14 a , and when the dimension from the outer edge 14 a 2 of the opening part 14 a to the metal mesh part 13 represents a fill depth, this fill depth is the largest in the part corresponding to the center area of the opening part 14 a . The screen printing plate does not cause the actual printing thickness to vary easily, even when the target printing thickness is reduced.
1. A screen printing plate, comprising:
a metal mesh part and a metal mask part provided on one side of the metal mesh part integrally with the metal mesh part;
wherein the metal mask part has at least one opening part, and
when a distance between a plane defined by an outer edge of the opening part and an exposed face of the metal mesh part represents a fill depth, the fill depth at a center area of the opening part is larger than the fill depth at an entire periphery of the opening part at the outer edge, and the fill depth is largest at the center area of the opening part.
2. The screen printing plate according to claim 1 , wherein the fill depth increases from a part corresponding to a peripheral area of the opening part toward the part corresponding to the center area of the opening part.
3. The screen printing plate according to claim 1 , wherein a thickness of the metal mesh part is smallest in the part corresponding to the center area of the opening part.
4. The screen printing plate according to claim 1 , wherein a thickness of the metal mesh part decreases from the part corresponding to a peripheral area of the opening part toward the part corresponding to the center area of the opening part.
5. The screen printing plate according to claim 1 , wherein the metal mesh part is constituted by a metal mesh and an electrodeposited metal provided on a surface of the metal mesh.
6. The screen printing plate according to claim 5 , wherein the metal mesh of the metal mesh part is calendered.
7. The screen printing plate according to claim 5 , wherein the metal mask part is constituted by a metal plate, and the metal plate constituting the metal mask part is joined to the metal mesh part by the electrodeposited metal provided on the surface of the metal mesh.
8. The screen printing plate according to claim 5 , wherein the metal mask part is constituted by an electrodeposited metal, and the electrodeposited metal constituting the metal mask part is joined to the electrodeposited metal provided on the surface of the metal mesh of the metal mesh part.
9. The screen printing plate according to claim 1 , wherein a thickness of the metal mask part is within a range of 0.3 to 4 μm.
10. The screen printing plate according to claim 1 , wherein a thickness of the metal mask part is within a range of 0.3 to 2.5 μm.
11. The screen printing plate according to claim 1 , wherein a thickness of the metal mask part is within a range of 0.3 to 1.5 μm.
12. A manufacturing method of electronic component using the screen printing plate according to claim 1 , the manufacturing method of electronic component comprising:
a step to produce first ceramic green sheets;
a step to produce second ceramic green sheets having unsintered conductor layers, by printing a conductor paste on surfaces of the first ceramic green sheets by using the screen printing plate, wherein each unsintered conductor layer is formed on each surface in a manner having a thickness corresponding to the fill depth adjusted in the opening part;
a step to produce an unsintered multilayer sheet by stacking alternately the first ceramic green sheets and the second ceramic green sheets;
a step to cut the unsintered multilayer sheet to produce unsintered component bodies;
a step to produce component bodies with built-in conductor layers by sintering the unsintered component bodies; and
a step to form external electrodes connected to the conductor layers, on the surfaces of the component bodies.
13. The manufacturing method of electronic component according to claim 12 , wherein the step to form external electrodes is implemented by utilizing, and at a same time as, a sintering process of the step to produce component bodies.
14. The manufacturing method of electronic component according to claim 12 , wherein the electronic component is a multilayer ceramic capacitor.
15. A screen printing plate comprising:
a metal mesh part and a metal mask part provided on one side of the metal mesh part integrally with the metal mesh part;
wherein the metal mask part has at least one opening part, and
when a distance between a plane defined by an outer edge of the opening part and an exposed face of the metal mesh part represents a fill depth, the fill depth is largest at a center area of the opening part,
wherein a thickness of the metal mesh part decreases from the part corresponding to a peripheral area of the opening part toward the part corresponding to the center area of the opening part.