Copper-clad laminate
To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.
1. A copper-clad laminate comprising:
a base film of which the whole body is made of a thermoplastic resin, wherein the base film has a thickness of 50 μm, and wherein the base film is subjected to surface modification treatment so that the surface of the resin base film becomes a clean state and further a fragile layer is removed;
an underlying metal layer film-formed on a surface of the base film by sputtering; and
a copper thin film layer film-formed on a surface of the underlying metal layer by sputtering,
wherein the underlying metal layer has a mean thickness of 0.3 to 1.9 nm.
2. The copper-clad laminate according to claim 1 , wherein the underlying metal layer has a mean thickness of 0.3 to 1.5 nm.
3. The copper-clad laminate according to claim 1 , wherein the underlying metal layer is formed of an alloy containing at least two types of elements selected from the group consisting of nickel, chromium, vanadium, titanium, molybdenum and copper.
4. The copper-clad laminate according to claim 1 , wherein the base film is a film of which the whole body is made of a liquid crystal polymer, a polyether ether ketone, a polyethylene naphthalate, a fluororesin, a thermoplastic polyimide or a cycloolefin polymer.
5. The copper-clad laminate according to claim 1 , wherein the underlying metal layer has a mean thickness of 0.3 to 0.9 nm.
6. The copper-clad laminate according to claim 1 , further comprising a copper plating film film-formed on a surface of the copper thin film layer.