IP Library › Granted Patent US 10,453,849
Granted Patent B2
US 10,453,849 · App. 15/936,396 · Granted Oct 22, 2019

Dynamic random access memory structure and method for forming the same

Inventors: En-Chiuan Liou (Tainan, TW); Yu-Cheng Tung (Kaohsiung, TW); Chih-Wei Yang (Tainan, TW); Sho-Shen Lee (New Taipei, TW)
Assignees: UNITED MICROELECTRONICS CORP.; Fujian Jinhua Integrated Circuit Co., Ltd.
H01L27/10897G11C11/401H01L27/10844
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,453,849
App. No.
15/936,396
Granted
Oct 22, 2019
Kind
B2
Abstract

The present invention provides a dynamic random access memory structure, comprising a substrate defining a cell region and a peripheral region on the substrate, a shallow trench isolation structure located in the peripheral region adjacent to the cell region, wherein the shallow trench isolation structure has a concave top surface, a first dummy bit line gate located within the shallow trench isolation structure of the peripheral area, and a second dummy bit line gate located in the cell region and adjacent to the first dummy bit line gate, wherein a top surface of the first dummy bit line gate is lower than a top surface of the second dummy bit line gate.

Claims (11)

1. A dynamic random access memory (DRAM) structure, comprising:

a substrate having a cell region and a peripheral region defined thereon;

a plurality of buried word lines, located in the cell region of the substrate;

a shallow trench isolation structure located in the peripheral region adjacent to the cell region, wherein the shallow trench isolation structure has a concave top surface;

a first dummy bit line gate located on the shallow trench isolation structure within the peripheral area; and

a second dummy bit line gate located in the cell region and adjacent to the first dummy bit line gate, wherein a top surface of the first dummy bit line gate is lower than a top surface of the second dummy bit line gate.

2. The dynamic random access memory structure of claim 1 , wherein the first dummy bit line gate is completely located on the shallow trench isolation structure.

3. The dynamic random access memory structure of claim 1 , further comprising a dielectric layer disposed on the substrate and on the shallow trench isolation structure.

4. The dynamic random access memory structure of claim 3 , wherein a portion of the dielectric layer is located between the first dummy bit line gate and the second dummy bit line gate.

5. The dynamic random access memory structure of claim 1 , wherein the first dummy bit line gate contacts the second dummy bit line gate directly.

6. The dynamic random access memory structure of claim 1 , wherein the first dummy bit line gate comprises a stacked structure of an amorphous silicon layer, a barrier layer and a metal layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2018
From: LIOU, EN-CHIUAN; TUNG, YU-CHENG; YANG, CHIH-WEI; LEE, SHO-SHEN
To: UNITED MICROELECTRONICS CORP.; FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
Reel/Frame 045364/0582 →
Priority Claims (1)
CN 2018 1 0171723 · Mar 1, 2018 · national
Continuity (1)
Related Publication 20190273083A1 · Sep 5, 2019
Cited By (2)
US 12,532,460 US 12,563,720