MIM capacitor, semiconductor structure including MIM capacitors and method for manufacturing the same
View Patent ↗A MIM capacitor includes a bottom electrode, a middle electrode disposed over the bottom electrode, a top electrode disposed over the middle electrode, a first dielectric layer sandwiched between the bottom electrode and the middle electrode, and a second dielectric layer sandwiched between the middle electrode and the top electrode. A surface of the bottom electrode and a surface of the top electrode respectively comprise a Ra value lower than 0.35 nm and a Rq value lower than 0.4 nm.
1. A metal-insulator-metal (MIM) capacitor comprising:
a bottom electrode;
a middle electrode disposed over the bottom electrode;
a top electrode disposed over the middle electrode;
a first dielectric layer sandwiched between the bottom electrode and the middle electrode; and
a second dielectric layer sandwiched between the middle electrode and the top electrode,
wherein a surface of the bottom electrode and a surface of the top electrode respectively comprise an arithmetical mean roughness (Ra) value lower than 0.35 nanometers (nm) and a root-mean-square roughness (Rq) value lower than 0.4 nm.
2. The MIM capacitor of claim 1 , wherein the bottom electrode comprises a single conductive layer or a multiple conductive layer.
3. The MIM capacitor of claim 2 , wherein the multiple conductive layer comprises a first lower layer and a first upper layer disposed on the first lower layer, and a thickness of the first upper layer is greater than a thickness of the first lower layer.
4. The MIM capacitor of claim 3 , wherein a ratio of the thickness of the first upper layer over the thickness of the first lower layer is greater than 2.
5. The MIM capacitor of claim 1 , wherein the middle electrode comprises a single conductive layer or a multiple conductive layer.
6. The MIM capacitor of claim 5 , wherein the multiple conductive layer comprises a second lower layer and a second upper layer disposed on the second lower layer, and a thickness of the second upper layer is greater than a thickness of the second lower layer.
7. The MIM capacitor of claim 6 , wherein a ratio of the thickness of the second upper layer over the thickness of the second lower layer is greater than.
8. The MIM capacitor of claim 1 , wherein the top electrode comprises a single conductive layer or a multiple conductive layer.
9. The MIM capacitor of claim 8 , wherein the multiple conductive layer comprises a third lower layer and a third upper layer disposed on the third lower layer, and a thickness of the third upper layer is greater than a thickness of the third lower layer.
10. The MIM capacitor of claim 9 , wherein a ratio of the thickness of the third upper layer over the thickness of the third lower layer is greater than 2.
11. The MIM capacitor of claim 1 , further comprising a conductor penetrating a pair including the bottom electrode and the middle electrode, a pair including the middle electrode and the top electrode, or a pair including the top electrode and the bottom electrode.
12. A semiconductor structure including MIM capacitors, comprising:
a substrate comprising a first region and a second region;
a first capacitor disposed in the first region and comprising a plurality of first electrodes; and
a second capacitor disposed in the second region and electrically isolated from the first capacitor, the second capacitor comprising a plurality of second electrodes,
wherein a surface of portions of the first electrodes and a surface of portions of the second electrodes respectively comprise an Ra value lower than 0.35 nm and a Rq value lower than 0.4 nm.
13. The semiconductor structure of claim 12 , further comprising a plurality of first conductors disposed in the first region and respectively electrically connected to the first electrodes, wherein the first electrodes of the first capacitor comprise a first bottom electrode, a first middle electrode and a third top electrode, and the first conductors are respectively electrically connected to the first bottom electrode, the first middle electrode and the first top electrode.
14. The semiconductor structure of claim 12 , further comprising at least one second conductor disposed in the second region, wherein the second electrodes of the second capacitor comprise a second top electrode, a second middle electrode and a second bottom electrode, the second conductor penetrates a pair comprising the second top electrode and the second middle electrode, a pair comprising the second middle electrode and the second bottom electrode, or a pair comprising the second top electrode and the second bottom electrode.
15. The semiconductor structure of claim 12 , wherein the first electrodes and the second electrodes respectively comprise a single layer or a multiple layer.
16. The semiconductor structure of claim 15 , wherein the multiple conductive layer comprises a lower layer and an upper layer disposed on the lower layer, and a thickness of the upper layer is greater than a thickness of the lower layer.
17. A method for manufacturing a semiconductor structure including a MIM capacitor, comprising:
forming a first conductive layer over a substrate by an atomic layer deposition (ALD);
patterning the first conductive layer to form a bottom electrode;
forming a first dielectric layer over the bottom electrode;
forming a second conductive layer over the first dielectric layer;
patterning the second conductive layer to form a middle electrode;
forming a second dielectric layer over the middle electrode;
forming a third conductive layer over the second dielectric layer by an ALD; and
patterning the third conductive layer to form a top electrode,
wherein a surface of the first conductive layer and a surface of the third conductive layer respectively comprise a Ra value lower than 0.35 nm and a Rq value lower than 0.4 nm.
18. The method of claim 17 , wherein the first conductive layer and the third conductive layer are respectively formed by the ALD and a physical vapor deposition (PVD).
19. The method of claim 17 , wherein the second conductive layer is formed by an ALD operation or a physical vapor deposition (PVD) operation.
20. The method of claim 17 , wherein a thickness of the first conductive layer, a thickness of the second conductive layer and a thickness of the third conductive layer are substantially the same.