Optical-detection element, solid-state imaging device, and method for driving solid-state imaging device
An optical-detection element includes a p-type supporting-layer, an n-type buried charge-generation region to implement a photodiode with the supporting-layer, a p-type shield region buried in the buried charge-generation region, a gate insulating-film contacted with the shield region, a transparent electrode on the gate insulating-film, a p-type well region buried in the supporting-layer, and an n + -type charge-readout region buried in the supporting-layer at an edge of the well region toward the buried charge-generation region.
1. An optical-detection element comprising:
a supporting-layer of a first conductivity type;
a buried charge-generation region of a second conductivity type buried in an upper portion of the supporting-layer to implement a photodiode with the supporting-layer;
a shield region of the first conductivity type having an impurity concentration higher than the supporting-layer and buried at an upper surface of the buried charge-generation region;
a gate insulating-film contacted with an upper surface of the shield region;
a transparent electrode provided on the gate insulating-film just above the buried charge-generation region, configured to implement a photogate structure, through which a light is incident on the buried charge-generation region;
a well region of the first conductivity type having a higher impurity concentration than the supporting-layer and buried in the upper portion of the supporting-layer; and
a charge-readout region of the second conductivity type having a higher impurity concentration than the buried charge-generation region and buried in the upper portion of the supporting-layer at an edge of the well region toward the buried charge-generation region,
wherein the impurity concentration of the shield region is set to a value such that an electrostatic potential at a surface side of the shield region is changeable by a voltage applied to the transparent electrode, and a surface potential of the shield region is pinned by charges of the first conductivity type by the electrostatic potential induced in the shield region.
2. The optical-detection element of claim 1 , further comprising:
a reset-drain region of the second conductivity type having a higher impurity concentration than the buried charge-generation region and buried in an upper portion of the well region separately from the charge-readout region; and
a reset-gate electrode stacked on the gate insulating-film and allocated above the well region between the charge-readout region and the reset-drain region.
3. The optical-detection element of claim 2 , wherein when a voltage is applied to the reset-gate electrode, charges accumulated in the charge-readout region are exhausted to the reset-drain region so as to reset the charge-readout region.
4. The optical-detection element of claim 1 , wherein the charge-readout region is in contact with the buried charge-generation region and the shield region.
5. The optical-detection element of claim 1 , wherein
the charge-readout region is separated from the buried charge-generation region and the shield region,
a transfer-gate electrode is further stacked on the gate insulating-film and allocated above the supporting-layer between the buried charge-generation region and the shield region and the charge-readout region, and
when a voltage is applied to the transfer-gate electrode, signal charges are transferred from the buried charge-generation region to the charge-readout region.
6. A solid-state imaging device in which a plurality of pixels is arranged, each of the plurality of pixels comprising:
a supporting-layer of a first conductivity type;
a buried charge-generation region of a second conductivity type buried in an upper portion of the supporting-layer to implement a photodiode with the supporting-layer;
a shield region of the first conductivity type having an impurity concentration higher than the supporting-layer and buried at an upper surface of the buried charge-generation region;
a gate insulating-film contacted with an upper surface of the shield region;
a transparent electrode provided on the gate insulating-film just above the buried charge-generation region, configured to implement a photogate structure, through which a light is incident on the buried charge-generation region;
a well region of the first conductivity type having a higher impurity concentration than the supporting-layer and buried in the upper portion of the supporting-layer; and
a charge-readout region of the second conductivity type having a higher impurity concentration than the buried charge-generation region and buried in the upper portion of the supporting-layer at an edge of the well region toward the buried charge-generation region,
wherein the impurity concentration of the shield region is set to a value such that an electrostatic potential at a surface side of the shield region is changeable by a voltage applied to the transparent electrode, and a surface potential of the shield region is pinned by charges of the first conductivity type by the electrostatic potential induced in the shield region.
7. The solid-state imaging device of claim 6 , wherein each of the plurality of pixels further comprises:
a reset-drain region of the second conductivity type having a higher impurity concentration than the buried charge-generation region and buried in an upper portion of the well region separately from the charge-readout region; and
a reset-gate electrode stacked on the gate insulating-film and allocated above the well region between the charge-readout region and the reset-drain region.
8. The solid-state imaging device of claim 7 , wherein in each of the plurality of pixels, when a voltage is applied to the reset-gate electrode, charges accumulated in the charge-readout region are exhausted to the reset-drain region so as to reset the charge-readout region.
9. The solid-state imaging device of claim 6 , wherein in each of the plurality of pixels, the charge-readout region is in contact with the buried charge-generation region and the shield region.
10. The solid-state imaging device of claim 6 , wherein in each of the plurality of pixels,
the charge-readout region is separated from the buried charge-generation region and the shield region,
a transfer-gate electrode is further stacked on the gate insulating-film and allocated above the supporting-layer between the buried charge-generation region and the shield region and the charge-readout region, and
when a voltage is applied to the transfer-gate electrode, signal charges are transferred from the buried charge-generation region to the charge-readout region.
11. The solid-state imaging device of claim 6 , further comprising a photogate scanner provided at a periphery of a pixel region in which the plurality of pixels are arranged, and configured to apply, to the transparent electrode in each of the plurality of pixels, a first voltage at which a surface potential at an interface between the shield region and the gate insulating-film is pinned by the charges of the first conductivity type and a second voltage shifted from the first voltage in a direction in which a channel potential of the buried charge-generation region deepens, each of the first voltage and the second voltage being applied at a timing of each of divided periods of one frame.
12. The solid-state imaging device of claim 11 , further comprising a reset-transistor scanner provided at the periphery of the pixel region, and configured to apply, to the reset-gate electrode in each of the plurality of pixels, a reset voltage for exhausting charges from the charge-readout region to the reset-drain region so as to reset the charge-readout region in a period in which the second voltage is applied, the charges having polarity shifted in an identical direction in which the second voltage is shifted.