Multilayer structure and method of forming the same
In a first aspect of a present inventive subject matter, a multilayer structure includes a base with a surface and an electrically-conductive metal oxide film that is positioned directly or via another layer on the base. At least a part of the surface of the base contains as a major component at least one selected from the group of copper, copper alloy, aluminum, aluminum alloy, magnesium, magnesium alloy, and stainless steel. The electrically-conductive metal oxide film is 30 nm or more in thickness. The multilayer structure is electrically-conductive and has a contact resistance that is 100 mΩcm 2 or less.
1. A multilayer structure comprising:
a base having a surface; and
an electrically-conductive metal oxide film that has been deposited directly on the base, wherein
at least a part of the surface of the base includes stainless steel as a major component,
the electrically-conductive metal oxide film is crystalline,
the electrically-conductive metal oxide film is 30 nm or more in thickness,
the electrically-conductive metal oxide film includes an oxide that has at least one metal selected from the group consisting of tin, zinc, chromium, and indium, and
the multilayer structure is electrically conductive and has a contact resistance that is 100 mΩcm 2 or less.
2. The multilayer structure of claim 1 , wherein the electrically-conductive metal oxide film includes two or more layers.
3. The multilayer structure of claim 1 , wherein the electrically-conductive metal oxide film includes an oxide of tin.
4. The multilayer structure of claim 1 , further comprising another electrically-conductive metal oxide film, wherein
the base has a plate shape,
the electrically-conductive metal oxide film is positioned directly on one side of the base, and
the another electrically-conductive metal oxide film is positioned directly or via another layer on another side of the base.
5. The multilayer structure of claim 1 , wherein the at least the part of the surface of the base has an uneven shape on that the electrically-conductive metal oxide film with 30 nm or more in thickness is arranged.
6. A fuel cell comprising:
the multilayer structure of claim 5 , wherein the uneven shape is a flow path pattern of fluid or gas.
7. An electronic device comprising the multilayer structure of claim 1 .
8. A multilayer structure comprising:
a base having a surface; and
an electrically-conductive metal oxide film that has been deposited directly on the base, wherein
at least a part of the surface of the base includes as a major component at least one selected from among copper, copper alloy, magnesium, magnesium alloy, and stainless steel,
the electrically-conductive metal oxide film is 30 nm or more in thickness,
the electrically-conductive metal oxide film includes an oxide that has at least one metal selected from the group consisting of tin, zinc, chromium, and indium,
the electrically-conductive metal oxide film is crystalline, and
the multilayer structure is electrically conductive and has a contact resistance that is 100 mΩcm 2 or less.