Micro electro mechanical system (MEMS) microphone
A micro electro mechanical system (MEMS) microphone includes a substrate, having a substrate opening. A supporting dielectric layer is disposed on the substrate surrounding the substrate opening. A diaphragm is supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure being convex toward the substrate opening when the diaphragm is at an operation off state. A backplate is disposed on the supporting dielectric layer over the diaphragm, wherein the backplate includes a plurality of venting holes at a region corresponding to the substrate opening.
1. A micro electro mechanical system (MEMS) microphone, comprising:
a substrate, having a substrate opening;
a supporting dielectric layer, disposed on the substrate surrounding the substrate opening;
a diaphragm, supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure bending as a convex shape toward the substrate opening when the diaphragm is at an operation off state, wherein the bowl-like structure has a central region and has a convex tip in the central region; and
a backplate, disposed on the supporting dielectric layer over the diaphragm, wherein the backplate comprises a plurality of venting holes at a region corresponding to the substrate opening.
2. The MEMS microphone of claim 1 , wherein the diaphragm is distant from the backplate by a first gap at a region supported by the supporting dielectric layer, and the convex tip of the convex shape of the diaphragm is distant from the backplate by a second gap, wherein the second gap is at least 5/4 times of the first gap.
3. The MEMS microphone of claim 2 , wherein the larger a diameter of the diaphragm, the larger the second gap is.
4. The MEMS microphone of claim 1 , wherein a periphery region of the diaphragm has a spring structure.
5. The MEMS microphone of claim 4 , wherein the spring structure is a meandering structure extending from a central region of the diaphragm to a sidewall of the supporting dielectric layer.
6. The MEMS microphone of claim 4 , wherein a peripheral region of the diaphragm has a plural of slit openings, so to form the spring structure.
7. The MEMS microphone of claim 1 , wherein the backplate comprises a passivation layer, a peripheral region of the passivation layer is disposed on the supporting dielectric layer.
8. The MEMS microphone of claim 1 , wherein the diaphragm is conductive.
9. The MEMS microphone of claim 8 , wherein the diaphragm is connected to a ground terminal and a conductive layer of the backplate corresponding to the substrate opening is connected to an operation voltage.
10. The MEMS microphone of claim 1 , wherein the diaphragm comprises a plurality of sublayers in stack to produce a stress force, so to form the bowl-like structure.
11. A micro electro mechanical system (MEMS) microphone, comprising:
a substrate, having a substrate opening;
a supporting dielectric layer, disposed on the substrate surrounding the substrate opening;
a backplate, supported by the supporting dielectric layer over the substrate opening, wherein the backplate comprises a plurality of venting holes at a region corresponding to the substrate opening;
a diaphragm, supported by the supporting dielectric layer over the backplate corresponding to the substrate opening, wherein the diaphragm has a bowl-like structure bending as a convex shape outward the substrate opening when the diaphragm is at an operation off state, wherein the bowl-like structure has a central region and has a convex tip in the central region; and
a passivation layer, disposed on the supporting dielectric layer and having an opening corresponding to the substrate opening.
12. The MEMS microphone of claim 11 , wherein the diaphragm is distant from the backplate by a first gap at a region supported by the supporting dielectric layer, and the convex tip of the convex shape of the diaphragm is distant from the backplate by a second gap, wherein the second gap is at least 5/4 times of the first gap.
13. The MEMS microphone of claim 12 , wherein the larger a diameter of the diaphragm, the larger the second gap is.
14. The MEMS microphone of claim 11 , wherein a periphery region of the diaphragm has a spring structure.
15. The MEMS microphone of claim 14 , wherein the spring structure is a meandering structure extending from a central region of the diaphragm to a sidewall of the supporting dielectric layer.
16. The MEMS microphone of claim 14 , wherein a peripheral region of the diaphragm has a plural of slit openings, so to form the spring structure.
17. The MEMS microphone of claim 11 , wherein the backplate comprises a passivation layer, a peripheral region of the passivation layer is disposed on the supporting dielectric layer.
18. The MEMS microphone of claim 11 , wherein the diaphragm is conductive.
19. The MEMS microphone of claim 18 , wherein the diaphragm is connected to a ground terminal and a conductive layer of the backplate corresponding to the substrate opening is connected to an operation voltage.
20. The MEMS microphone of claim 11 , wherein the diaphragm comprises a plurality of sublayers in stack to produce a stress force, so to form the bowl-like structure.