Movable structure and film forming apparatus

1. A movable structure comprising:

a processing chamber configured to perform processing under a vacuum environment;

a fixed portion disposed in the processing chamber;

a movable portion that is movable with respect to the fixed portion;

a transmission/reception module provided at the fixed portion and having a hermetically sealed structure; and

a sensor module provided at the movable portion and having a hermetically sealed structure,

wherein the sensor module receives a power signal from the transmission/reception module in a non-contact manner,

the transmission/reception module receives a sensor signal from the sensor module in a non-contact manner,

the movable portion is a mounting table configured to mount thereon a substrate,

the mounting table includes an electrostatic chuck, and

power is supplied from an electrode of the electrostatic chuck to the sensor module in a non-contact manner when the sensor module cannot receive the power signal from the transmission/reception module or when reception of the power signal is unstable.

2. The movable structure of claim 1 , wherein the fixed portion is provided with one transmission/reception module,

the movable portion is provided with a plurality of sensor modules, and

said one transmission/reception module transmits the power signal to at least one of the plurality of sensor modules and receives the sensor signal from at least one of the plurality of sensor modules.

3. The movable structure of claim 1 , wherein the fixed portion includes a cooling mechanism configured to cool the mounting table.

4. The movable structure of claim 3 , wherein the cooling mechanism cools the mounting table to a cryogenic temperature.

5. The movable structure of claim 3 , wherein the cooling mechanism is arranged such that a center thereof coincides with a central axis that is a rotation center of the mounting table.

6. The movable structure of claim 3 , wherein the cooling mechanism includes a freezer and a freezing heat transfer body provided on the freezer, and

a cooling gas passage through which a cooling gas is supplied is provided between an upper surface of the freezing heat transfer body and a lower surface of the mounting table.

7. The movable structure of claim 1 , wherein the sensor module includes a temperature sensor configured to measure a temperature of the movable portion.

8. The movable structure of claim 7 , wherein the temperature sensor is a diode sensor.

9. The movable structure of claim 7 , wherein the temperature sensor is a thermocouple.

10. A film forming apparatus comprising:

a movable structure comprising:

a processing chamber configured to perform processing under a vacuum environment,

a fixed portion disposed in the processing chamber,

a movable portion that is movable with respect to the fixed portion,

a transmission/reception module provided at the fixed portion and having a hermetically sealed structure, and

a sensor module provided at the movable portion and having a hermetically sealed structure,

wherein the sensor module receives a power signal from the transmission/reception module in a non-contact manner,

wherein the transmission/reception module receives a sensor signal from the sensor module in a non-contact manner,

wherein the movable portion is a mounting table configured to mount thereon a substrate,

wherein the mounting table includes an electrostatic chuck, and

wherein power is supplied from an electrode of the electrostatic chuck to the sensor module in a non-contact manner when the sensor module cannot receive the power signal from the transmission/reception module or when reception of the power signal is unstable; and

a target provided in the processing chamber.