Systems and methods for material breakthrough
Methods may be performed to limit footing, pitch walking, and other alignment issues. The methods may include forming a treatment gas plasma within a processing region of a semiconductor processing chamber. The methods may further include directing effluents of the treatment gas plasma towards a semiconductor substrate within the processing region of the semiconductor processing chamber, and anisotropically modifying a surface of a first material on the semiconductor substrate with the effluents of the treatment gas plasma. The methods may also include passivating a surface of a second material on the semiconductor substrate with the effluents of the treatment gas plasma. The methods may further include forming a remote fluorine-containing plasma to produce fluorine-containing plasma effluents, and flowing the fluorine-containing plasma effluents to the processing region of the semiconductor processing chamber. The methods may also include selectively removing the modified surface of the first material from the semiconductor substrate.
1. An etching method comprising:
forming a treatment gas plasma within a processing region of a semiconductor processing chamber;
modifying a surface of a first material on a semiconductor substrate within the processing region of the semiconductor processing chamber with effluents of the treatment gas plasma;
modifying a surface of a second material on the semiconductor substrate with the effluents of the treatment gas plasma;
forming a remote plasma from a fluorine-containing precursor to produce fluorine-containing plasma effluents;
flowing the fluorine-containing plasma effluents to the processing region of the semiconductor processing chamber;
flowing water vapor to the processing region of the semiconductor processing chamber; and
selectively removing the modified surface of the first material from the semiconductor substrate.
2. The etching method of claim 1 , wherein a temperature of the semiconductor substrate is maintained between about 5° C. and about 35° C.
3. The etching method of claim 1 , wherein the fluorine-containing plasma effluents are formed in a remote region of the semiconductor processing chamber fluidly coupled with, and physically separated from, the processing region of the semiconductor processing chamber.
4. The etching method of claim 1 , wherein the fluorine-containing plasma effluents are produced by a capacitively-coupled plasma at a power level of less than or about 300 W.
5. The etching method of claim 1 , wherein the first material comprises a spacer material including an oxide material, the second material comprises a hardmask material including a nitride material.
6. The etching method of claim 1 , wherein the etching method has a selectivity of at least 7:1 of the modified first material relative to the modified second material.
7. An etching method comprising:
forming a treatment gas plasma within a processing region of a semiconductor processing chamber;
modifying a surface of a first material on a semiconductor substrate within the processing region of the semiconductor processing chamber with effluents of the treatment gas plasma, wherein the semiconductor substrate further comprises a second material different from the first material;
forming a remote plasma from a fluorine-containing precursor to produce fluorine-containing plasma effluents;
flowing the fluorine-containing plasma effluents to the processing region of the semiconductor processing chamber;
flowing water vapor to the processing region of the semiconductor processing chamber; and
selectively removing the modified surface of the first material from the semiconductor substrate.
8. The etching method of claim 7 , further comprising modifying a surface of the second material on the semiconductor substrate with the effluents of the treatment gas plasma.
9. The etching method of claim 7 , further comprising adsorbing the water vapor at the surface of the first material.
10. The etching method of claim 7 , wherein a temperature of the semiconductor substrate is maintained between about 5° C. and about 35° C.
11. The etching method of claim 7 , wherein the fluorine-containing plasma effluents are formed in a remote region of the semiconductor processing chamber fluidly coupled with, and physically separated from, the processing region of the semiconductor processing chamber.
12. The etching method of claim 7 , wherein the first material comprises a spacer material including an oxide material, the second material comprises a hardmask material including a nitride material.
13. The etching method of claim 7 , wherein the etching method has a selectivity of at least 7:1 of the modified first material relative to the modified second material.
14. An etching method comprising:
forming a treatment gas plasma within a processing region of a semiconductor processing chamber;
modifying a surface of a first material on a semiconductor substrate within the processing region of the semiconductor processing chamber with effluents of the treatment gas plasma;
modifying a surface of a second material on the semiconductor substrate with the effluents of the treatment gas plasma;
forming a remote plasma from a fluorine-containing precursor to produce fluorine-containing plasma effluents;
flowing the fluorine-containing plasma effluents to the processing region of the semiconductor processing chamber;
flowing water vapor to the processing region of the semiconductor processing chamber to combine with the fluorine-containing plasma effluents; and
selectively removing the modified surface of the first material from the semiconductor substrate.
15. The etching method of claim 14 , wherein a temperature of the semiconductor substrate is maintained between about 0° C. and about 50° C.
16. The etching method of claim 14 , wherein the fluorine-containing plasma effluents are formed in a remote region of the semiconductor processing chamber fluidly coupled with, and physically separated from, the processing region of the semiconductor processing chamber.
17. The etching method of claim 16 , wherein the water vapor bypasses the remote plasma region of the semiconductor processing chamber when flowed to the processing region of the semiconductor processing chamber.
18. The etching method of claim 14 , wherein the fluorine-containing plasma effluents are produced by a capacitively-coupled plasma at a power level of less than or about 500 W.
19. The etching method of claim 14 , wherein the first material comprises a spacer material including an oxide material, the second material comprises a hardmask material including a nitride material.
20. The etching method of claim 14 , wherein the etching method has a selectivity of at least 5:1 of the modified first material relative to the modified second material.