Relative height adjustable connector system for motherboard to graphics board transition in information handling systems

1. An information handling system comprising:

a chassis supporting a motherboard having a processor;

a graphics board including a graphics processor;

a flexible compression jumper connector having a first compression jumper pad with a first array of compressible communication contacts operatively coupled to a first connector pad interface area with a plurality of electrical contacts on the motherboard;

a first clamping mechanism to compress the first array of compressible communication contacts to the plurality of electrical contacts on the motherboard;

the flexible compression jumper connector having a second compression jumper pad with a second array of compressible communication contacts operatively coupled to a second connector pad interface area with a corresponding array of electrical contacts on the graphics board;

a second clamping mechanism to compress the second array of compressible communication contacts to the plurality of electrical contacts on the graphics board; and

the flexible compression jumper connector having an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad such that the relative height of the graphics board adjacent to the motherboard may be modified.

2. The system of claim 1 , wherein the first array of compressible communication contacts is an array of electrical spring contacts making electrical contact when compressed to the first connector pad interface area.

3. The system of claim 1 , wherein the first connector pad interface area with a plurality of electrical contacts on the motherboard includes an array of electrical contacts on the motherboard corresponding to the first array of compressible communication contacts of the first compression jumper pad.

4. The system of claim 1 , wherein the second array of compressible communication contacts is an array of electrical spring contacts making electrical contact when compressed to the second connector pad interface area.

5. The system of claim 1 , wherein the first clamping mechanism and the second clamping mechanism are compression screws disposed through the first compression jumper pad and the second compression jumper pad respectively.

6. The system of claim 1 , further comprising:

a plurality of flexible compression jumper connectors operatively coupling the mother board and the graphics board.

7. The system of claim 1 , further comprising:

a plurality of PCIe lanes between the motherboard and the graphics board for communication via the flexible compression jumper connector.

8. The system of claim 1 , further comprising:

a plurality of display port channels between the motherboard and the graphics board for communication via the flexible compression jumper connector.

9. An information handling system comprising:

a chassis supporting a motherboard having a central processor;

a graphics board including a graphics processor;

a flexible compression jumper connector having a first compression jumper pad with a first array of compressible electrical spring contacts operatively coupled to a first connector pad interface area with a plurality of electrical contacts on the motherboard;

the flexible compression jumper connector having a second compression jumper pad with a second array of compressible electrical spring contacts operatively coupled to a second connector pad interface area with a corresponding array of electrical contacts on the graphics board; and

the flexible compression jumper connector having an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad such that the relative height of the graphics board adjacent to the motherboard may be modified such that a top of central processor and a top of the graphics processor align in height relative to the bottom of the chassis.

10. The system of claim 9 , further comprising:

a planar heat pipe operatively coupled to the top of the central processor and the top of the graphics processor.

11. The system of claim 9 , wherein the first connector pad interface area with a plurality of electrical contacts on the motherboard is electrically coupled for communication of data with the first compression jumper pad when the first array of compressible electrical spring contacts are compressed to the first connector pad interface area on the motherboard.

12. The system of claim 9 , wherein the second connector pad interface area with a plurality of electrical contacts on the graphics board is electrically coupled for communication of data with the second compression jumper pad when the second array of compressible electrical spring contacts are compressed to the second connector pad interface area on the graphics board.

13. The system of claim 9 , further comprising:

a compression screw disposed through the first compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the motherboard to compress the first array of compressible electrical spring contacts to the first connector pad interface area.

14. The system of claim 9 , further comprising:

a compression screw disposed through the second compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the graphics board to compress the second array of compressible electrical spring contacts to the second connector pad interface area.

15. The system of claim 9 , further comprising:

a plurality of flexible compression jumper connectors operatively coupling the mother board and the graphics board.

16. An information handling system comprising:

a chassis supporting a motherboard having a central processor;

a graphics board including a graphics processor;

a flexible compression jumper connector having a first compression jumper pad with a plurality of electrical contacts operatively coupled to a first connector pad interface area with a first array of compressible electrical spring contacts on the motherboard;

a first clamping mechanism to compress the first compression jumper pad to the first connector pad interface area on the motherboard;

the flexible compression jumper connector having a second compression jumper pad with a plurality of electrical contacts operatively coupled to a second connector pad interface area with a second array of compressible electrical spring contacts on the graphics board;

a second clamping mechanism to compress the second compression jumper pad to the second connector pad interface area on the graphics board; and

the flexible compression jumper connector having an adjustable jumper trace array cable between the first compression jumper pad and the second compression jumper pad such that the relative height of the graphics board adjacent to the motherboard may be modified such that a top of central processor and a top of the graphics processor align in height relative to the bottom of the chassis.

17. The system of claim 16 , further comprising:

the relative height of the graphics board adjacent to the motherboard aligned such that a top of central processor and a top of the graphics processor align in height relative to the bottom of the chassis; and

a planar heat pipe operatively coupled to the top of the central processor and the top of the graphics processor.

18. The system of claim 16 , wherein the first clamping mechanism is a compression screw disposed through the first compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the motherboard to compress the first array of compressible electrical spring contacts to the first connector pad interface area.

19. The system of claim 16 , the second clamping mechanism is a compression screw disposed through the second compression jumper pad of the flexible compression jumper connector and into a receiver disposed with the graphics board to compress the second array of compressible electrical spring contacts to the second connector pad interface area.

20. The system of claim 16 , further comprising:

a planar heat pipe operatively coupled to the top of the central processor and the top of the graphics processor.