IP Library Granted Patent US 12,578,770
Granted Patent B2
US 12,578,770 · App. 18/649,062 · Granted Mar 17, 2026

Hinge mechanism for mounting a printed circuit board in an information handling system

Inventors: Jeffrey M. Lewis (Maynard, MA); Nicholas R. Laviolette (Sudbury, MA)
Assignee: Dell Products L.P.
G06F1/185H05K7/1418
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Quick Facts
Patent No.
US 12,578,770
App. No.
18/649,062
Granted
Mar 17, 2026
Kind
B2
Abstract

An information handling system includes an interconnect card, a first card guide, and a second card guide. The first card guide is in physical communication with the interconnect card. The second card guide is in physical communication with the interconnect card. The second card guide includes a hinge arm configured to transition between an open position and a locked position. The hinge arm is in the open position when the interconnect card is inserted in between the first and second card guides. The hinge arm is in the locked position to secure the interconnect card when the interconnect card is positioned between the first and second card guides.

Claims (33)

1 . An information handling system comprising:

an interconnect card;

a first card guide in physical communication with the interconnect card; and

a second card guide in physical communication with the interconnect card, the second card guide including:

a hinge arm configured to transition between an open position and a locked position, wherein the hinge arm is in the open position when the interconnect card is inserted in between the first and second card guides, and the hinge arm is in the locked position to secure the interconnect card when the interconnect card is positioned between the first and second card guides; and

a hinge joint located in between a first snap lock component and the hinge arm, the hinge joint to flex as the hinge arm transitions between the open position and the locked position, wherein the first snap lock component flexes away from the interconnect card when the interconnect card is inserted in between the first and second card guides, and snap fits behind a first back corner of the interconnect card when the interconnect card is positioned between the first and second card guides.

2 . The information handling system of claim 1 , wherein the first card guide includes a second snap lock component, wherein the second snap lock component flexes away from the interconnect card when the interconnect card is inserted in between the first and second card guides, and the second snap lock component snap fits behind a second back corner of the interconnect card when the interconnect card is positioned between the first and second card guides.

3 . The information handling system of claim 2 , wherein the hinge arm includes a flex latch, the flex latch snap fits over the second snap lock component when the hinge arm is in the locked position.

4 . The information handling system of claim 1 , wherein the first snap lock component, the hinge joint, and the hinge arm are all a single all-in-one component.

5 . The information handling system of claim 1 , wherein the hinge joint automatically unflexes when the hinge arm is released from the locked position.

6 . The information handling system of claim 5 , wherein the hinge joint causes the hinge arm to transition toward the open position when the hinge joint unflexes.

7 . An information handling system comprising:

a main board;

an interconnect card configured to communicate with the main board;

a first card guide in physical communication with the interconnect card;

a second card guide in physical communication with the interconnect card, the second card guide including a hinge arm configured to transition between an open position and a locked position, wherein the hinge arm is in the open position when the interconnect card is inserted between the first and second card guides, and the hinge arm is in the locked position to secure the interconnect card when the interconnect card is positioned between the first and second card guides and above the main board; and

a hinge joint located in between a first snap lock component and the hinge arm, the hinge joint to flex as the hinge arm transitions between the open position and the locked position, wherein the first snap lock component flexes away from the interconnect card when the interconnect card is inserted in between the first and second card guides, and snap fits behind a first back corner of the interconnect card when the interconnect card is positioned between the first and second card guides.

8 . The information handling system of claim 7 , wherein the first card guide includes a second snap lock component, wherein the second snap lock component flexes away from the interconnect card when the interconnect card is inserted in between the first and second card guides, and the second snap lock component snap fits behind a second back corner of the interconnect card when the interconnect card is positioned between the first and second card guides.

9 . The information handling system of claim 8 , wherein the hinge arm includes a flex latch, the flex latch snap fits over the second snap lock component when the hinge arm is in the locked position.

10 . The information handling system of claim 7 , wherein the first snap lock component, the hinge joint, and the hinge arm are all a single all-in-one component.

11 . The information handling system of claim 7 , wherein the hinge joint automatically unflexes when the hinge arm is released from the locked position.

12 . The information handling system of claim 11 , wherein the hinge joint causes the hinge arm to transition toward the open position when the hinge joint unflexes.

13 . An information handling system comprising:

a main board;

an interconnect card configured to communicate with the main board;

a first card guide including a first snap lock component, the first snap lock component flexing away from the interconnect card when the interconnect card is inserted along the first card guide; and

a second card guide in physical communication with the interconnect card, the second card guide including:

a hinge arm configured to transition between an open position and a locked position, wherein the hinge arm is in the open position when the interconnect card is inserted in between the first and second card guides, and the hinge arm is in the locked position to secure the interconnect card when the interconnect card is positioned between the first and second card guides and above the main board; and

a second snap lock component, the second snap lock component flexes away from the interconnect card when the interconnect card is inserted in between the first and second card guides, wherein the first snap lock component snap fits behind a first back corner of the interconnect card when the interconnect card is positioned between the first and second card guides, and wherein the second snap lock component snap fits behind a second back corner of the interconnect card when the interconnect card is positioned between the first and second card guides;

a hinge joint located in between the second snap lock component and the hinge arm, the hinge joint to flex as the hinge arm transitions between the open position and the locked position; and

a flex latch on the hinge arm, the flex latch snap fits over the first snap lock component when the hinge arm is in the locked position.

14 . The information handling system of claim 13 , wherein the second snap lock component, the hinge joint, and the hinge arm are all a single all-in-one component.

15 . The information handling system of claim 13 , wherein the hinge joint automatically unflexes when the hinge arm is released from the locked position and causes the hinge arm to transition toward the open position when the hinge joint unflexes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2024
From: LEWIS, JEFFREY M.; LAVIOLETTE, NICHOLAS R.
To: DELL PRODUCTS L.P.
Reel/Frame 067254/0754 →
Continuity (1)
Related Publication 20250335010A1 · Oct 30, 2025
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