Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal

1. A fingerprint module, comprising:

a cover plate, a fingerprint chip, an intermediate board, and a circuit board;

wherein the cover plate defines an assembling region;

the fingerprint chip is fixed in the assembling region and has a plurality of pads;

the intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate;

the fingerprint chip is electrically connected to the intermediate board via the pads;

the circuit board is electrically connected to the fingerprint chip via the intermediate board;

the pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip;

wherein the intermediate board comprises a first contact surface bonded to the fingerprint chip and a second contact surface opposite to the first contact surface, a plurality of first pins are electrically connected to the fingerprint chip and disposed on the first contact surface, the first pins are soldered to the pads, a plurality of second pins are electrically connected to the first pins and disposed on the second contact surface, and the circuit board is bonded to the second contact surface and electrically connected to the second pins; and

the circuit board comprises a first terminal and a second terminal, the first terminal is soldered to the second pins of the intermediate board, a connector is disposed at the second terminal, and the connector is pluggable into a main board of a mobile terminal.

2. The fingerprint module of claim 1 , wherein the intermediate board is a printed circuit board.

3. The fingerprint module of claim 2 , wherein the intermediate board and the circuit board are electrically connected via solder, a board-to-board connector, or an electrically conductive adhesive.

4. The fingerprint module of claim 2 , wherein the circuit board is a flexible circuit board or a printed circuit board.

5. The fingerprint module of claim 2 , wherein the cover plate comprises an inner surface and an outer surface disposed opposite to the inner surface, the outer surface is configured to receive a fingerprint of a user, a groove is defined in the outer surface or the inner surface, and the assembling region is situated in the groove in the inner surface or situated at a position in the inner surface corresponding to the groove in the outer surface.

6. The fingerprint module of claim 1 , wherein the intermediate board and the circuit board are electrically connected via solder, a board-to-board connector, or an electrically conductive adhesive.

7. The fingerprint module of claim 1 , wherein the circuit board is a flexible circuit board or a printed circuit board.

8. The fingerprint module of claim 1 , wherein the cover plate comprises an inner surface and an outer surface disposed opposite to the inner surface, the outer surface is configured to receive a fingerprint of a user, a groove is defined in the outer surface or the inner surface, and the assembling region is situated in the groove in the inner surface or situated at a position in the inner surface corresponding to the groove in the outer surface.

9. The fingerprint module of claim 1 , wherein the intermediate board and the circuit board are electrically connected via solder, a board-to-board connector, or an electrically conductive adhesive.

10. The fingerprint module of claim 1 , wherein the circuit board is a flexible circuit board or a printed circuit board.

11. The fingerprint module of claim 1 , wherein the cover plate comprises an inner surface and an outer surface disposed opposite to the inner surface, the outer surface is configured to receive a fingerprint of a user, a groove is defined in the outer surface or the inner surface, and the assembling region is situated in the groove in the inner surface or situated at a position in the inner surface corresponding to the groove in the outer surface.

12. A method for manufacturing a fingerprint module, comprising:

providing a cover plate, a fingerprint chip, and an intermediate board, disposing a plurality of pads on the fingerprint chip, electrically connecting the fingerprint chip to the intermediate board via the pads, and fixing the fingerprint chip in the cover plate, wherein the intermediate board presses the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate; and

providing a circuit board, electrically connecting the circuit board to the fingerprint chip via the intermediate board, and connecting the pads to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip;

wherein the intermediate board comprises a first contact surface bonded to the fingerprint chip and a second contact surface opposite to the first contact surface, a plurality of first pins are electrically connected to the fingerprint chip and disposed on the first contact surface, the first pins are soldered to the pads, a plurality of second pins are electrically connected to the first pins and disposed on the second contact surface, and the circuit board is bonded to the second contact surface and electrically connected to the second pins; and

the circuit board comprises a first terminal and a second terminal, the first terminal is soldered to the second pins of the intermediate board, a connector is disposed at the second terminal, and the connector is pluggable into a main board of a mobile terminal.

13. The method for manufacturing the fingerprint module of claim 12 , wherein the circuit board is a flexible circuit board, and the intermediate board and the circuit board are electrically connected via solder, a board-to-board connector, or an electrically conductive adhesive.

14. The method for manufacturing the fingerprint module of claim 12 , wherein the cover plate comprises an inner surface and an outer surface disposed opposite to the inner surface, the outer surface is configured to receive a fingerprint of a user, and the fingerprint chip is bonded to the inner surface via an adhesive.

15. A mobile terminal, comprising a fingerprint module, the fingerprint module comprising:

a cover plate, a fingerprint chip, an intermediate board, and a circuit board;

wherein the cover plate defines an assembling region;

the fingerprint chip is fixed in the assembling region and has a plurality of pads;

the intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate;

the fingerprint chip is electrically connected to the intermediate board via the pads;

the circuit board is electrically connected to the fingerprint chip via the intermediate board;

the pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip;

wherein the intermediate board comprises a first contact surface bonded to the fingerprint chip and a second contact surface opposite to the first contact surface, a plurality of first pins are electrically connected to the fingerprint chip and disposed on the first contact surface, the first pins are soldered to the pads, a plurality of second pins are electrically connected to the first pins and disposed on the second contact surface, and the circuit board is bonded to the second contact surface and electrically connected to the second pins; and

the circuit board comprises a first terminal and a second terminal, the first terminal is soldered to the second pins of the intermediate board, a connector is disposed at the second terminal, and the connector is pluggable into a main board of a mobile terminal.

16. The mobile terminal of claim 15 , wherein the intermediate board is a printed circuit board.

17. The mobile terminal of claim 15 , wherein the intermediate board and the circuit board are electrically connected via solder, a board-to-board connector, or an electrically conductive adhesive.

18. The mobile terminal of claim 15 , wherein the cover plate comprises an inner surface and an outer surface disposed opposite to the inner surface, the outer surface is configured to receive a fingerprint of a user, a groove is defined in the outer surface or the inner surface, and the assembling region is situated in the groove in the inner surface or situated at a position in the inner surface corresponding to the groove in the outer surface.