Package on package structure

1. A package on package structure, comprising:

a first package;

a plurality of conductive bumps disposed on a surface of the first package and electrically connected to the first package;

a second package disposed on the surface of the first package through the conductive bumps, and comprising a plurality of semiconductor devices and an encapsulating material encapsulating the semiconductor devices, wherein a shortest distance from an upper surface of the encapsulating material to a topmost surface of the semiconductor devices is greater than or substantially equal to twice a thickness of the semiconductor devices; and

an underfill filled between the first package and the second package.

2. The package on package structure as claimed in claim 1 , wherein the conductive bumps are disposed on a peripheral region of the surface.

3. The package on package structure as claimed in claim 1 , wherein a lower surface of the second package is curved toward the surface of the first package, wherein the lower surface faces the surface.

4. The package on package structure as claimed in claim 1 , wherein a shortest distance from a central region of the surface to the second package is smaller than a shortest distance from anywhere on a peripheral region of the surface to the second package.

5. The package on package structure as claimed in claim 1 , wherein a distance between the first package and the second package gradually reduces from a peripheral region to a central region of the package on package structure.

6. The package on package structure as claimed in claim 1 , wherein the plurality of semiconductor devices are disposed side-by-side in the encapsulating material.

7. The package on package structure as claimed in claim 1 , wherein at least two semiconductor devices among the plurality of semiconductor devices are stacked and embedded in the encapsulating material.

8. The package on package structure as claimed in claim 1 , wherein the underfill covers a central region and a peripheral region of the surface and encapsulates the conductive bumps.

9. A package on package structure, comprising:

an encapsulated semiconductor device comprises a first semiconductor device, a first encapsulating material encapsulating the first semiconductor device, and a plurality of through vias extending through the first encapsulating material; and

a redistribution structure disposed on a first surface of the encapsulated semiconductor device and electrically connected to the encapsulated semiconductor device;

a plurality of conductive bumps disposed on a second surface of the encapsulated semiconductor device and electrically connected to the encapsulated semiconductor device, wherein the second surface is opposite to the first surface;

a second package disposed on a second surface of the encapsulated semiconductor device, and comprising a plurality of second semiconductor devices and a second encapsulating material encapsulating the second semiconductor devices, wherein a shortest distance from an upper surface of the second encapsulating material to a topmost surface of the second semiconductor devices is greater than or substantially equal to twice a thickness of the second semiconductor devices; and

an underfill filled between the encapsulated semiconductor device and the second package.

10. The package on package structure as claimed in claim 9 , wherein a shortest distance from a central region of the second surface to the second package is smaller than a shortest distance from anywhere on a peripheral region of the second surface to the second package.

11. The package on package structure as claimed in claim 10 , wherein the conductive bumps are disposed on the peripheral region.

12. The package on package structure as claimed in claim 10 , wherein the underfill covers the central region and the peripheral region and encapsulates the conductive bumps.

13. The package on package structure as claimed in claim 9 , wherein the plurality of second semiconductor devices are disposed side-by-side in the second encapsulating material.

14. The package on package structure as claimed in claim 13 , wherein at least two second semiconductor devices among the plurality of second semiconductor devices are stacked and embedded in the encapsulating material.

15. The package on package structure as claimed in claim 9 , wherein a lower surface of the second package is curved toward the surface.

16. A package on package structure, comprising:

a first package comprising an encapsulated semiconductor device and a redistribution structure disposed on a first surface of the encapsulated semiconductor device and electrically connected to the encapsulated semiconductor device;

a plurality of conductive bumps disposed on a second surface of the encapsulated semiconductor device and electrically connected to the encapsulated semiconductor device;

a second package disposed on the second surface through the conductive bumps and comprising a plurality of semiconductor devices and an encapsulating material encapsulating the semiconductor devices, wherein a shortest distance from an upper surface of the encapsulating material to a topmost surface of the semiconductor devices is greater than or substantially equal to twice a greatest thickness of the semiconductor devices; and

an underfill filled between the first package and the second package.

17. The package on package structure as claimed in claim 16 , wherein a shortest distance from a central region of the second surface to the second package is smaller than a shortest distance from anywhere on a peripheral region of the second surface to the second package.

18. The package on package structure as claimed in claim 16 , wherein a lower surface of the second package is curved toward the second surface.

19. The package on package structure as claimed in claim 16 , wherein the semiconductor devices are arranged in a side-by-side manner.

20. The package on package structure as claimed in claim 16 , wherein the semiconductor devices are stacked on top of one another.