Encapsulation structure, method for producing the same, and display apparatus
Provided are an encapsulation structure, a method for producing the same, and a display apparatus. The encapsulation structure comprising a plurality of layers covering the outside of a device to be encapsulated, wherein the plurality of layers comprises an inorganic layer and an organic layer, which are stacked alternatively, wherein the organic layer comprises an organic layer matrix and hydrophobic particles, and wherein the hydrophobic particle comprises an inorganic nanoparticle and a hydrophobic group.
1. An encapsulation structure, comprising a plurality of layers covering the outside of a device to be encapsulated,
wherein the plurality of layers comprises an inorganic layer and an organic layer, which are stacked alternatively,
wherein the organic layer comprises an organic layer matrix and hydrophobic particles dispersed in the organic layer matrix, and
wherein constituents of the hydrophobic particle comprises:
an inorganic nanoparticle,
and a hydrophobic group bonded to the inorganic nanoparticle.
2. The encapsulation structure according to claim 1 , wherein the hydrophobic particle comprises a core of the inorganic nanoparticle and a shell comprising the hydrophobic group.
3. The encapsulation structure according to claim 1 , wherein the plurality of layers comprises an inorganic layer, an organic layer and an inorganic layer, which are stacked alternatively.
4. The encapsulation structure according to claim 1 , wherein the hydrophobic group comprises at least one of alkyl, aryl, and arylalkyl.
5. The encapsulation structure according to claim 1 , wherein the inorganic nanoparticle includes at least one of a silica particle, a magnesium oxide particle, a magnesium fluoride particle, a titanium oxide particle, a zinc oxide particle, a zinc sulfide particle, an alumina particle, and a zirconia particle.
6. The encapsulation structure according to claim 1 , further comprising a hydrophobic layer between the inorganic layer and the organic layer, wherein the elasticity of the hydrophobic layer is larger than that of the inorganic layer.
7. The encapsulation structure according to claim 6 , wherein the hydrophobic layer is formed of the hydrophobic particles.
8. The encapsulation structure according to claim 1 , wherein the hydrophobic particle is formed of a material having a wide band gap, and the transparency of the hydrophobic particle is more than 0.9.
9. The encapsulation structure according to claim 1 , wherein the organic layer matrix is formed of a material selected from the group consisting of a UV-curable material and a thermal-curable material.
10. The encapsulation structure according to claim 1 , wherein the inorganic layer is formed of at least one material selected from silica, silicon nitride and silicon oxynitride.
11. A method for producing the encapsulation structure according to claim 1 , comprising:
forming an inorganic layer covering a device to be encapsulated on the outside of the device to be encapsulated; and
forming an organic layer covering the inorganic layer on the outside of the inorganic layer, wherein the organic layer comprises an organic layer matrix and hydrophobic particles,
wherein the hydrophobic particle comprises an inorganic nanoparticle and a hydrophobic group.
12. The method according to claim 11 , wherein the hydrophobic particle comprises a core of the inorganic nanoparticle and a shell comprising the hydrophobic group.
13. The method according to claim 11 , wherein the hydrophobic group comprises at least one of alkyl, aryl, and arylalkyl.
14. The method according to claim 11 , wherein the inorganic nanoparticle includes at least one of a silica particle, a magnesium oxide particle, a magnesium fluoride particle, a titanium oxide particle, a zinc oxide particle, a zinc sulfide particle, an alumina particle, and a zirconia particle.
15. The method according to claim 11 , wherein said forming an organic layer covering the inorganic layer on the outside of the inorganic layer comprises:
forming a hydrophobic layer covering the inorganic layer on the outside of the inorganic layer, wherein the elasticity of the hydrophobic layer is larger than that of the inorganic layer; and
forming the organic layer on the outside of the hydrophobic layer, to cover the hydrophobic layer.
16. The method according to claim 15 , wherein said forming a hydrophobic layer covering the inorganic layer on the outside of the inorganic layer comprises:
forming a hydrophobic layer covering the inorganic layer on the outside of the inorganic layer by an ink jet printing process or a spin coating process by using the hydrophobic particles.
17. The method according to claim 11 , wherein said forming an organic layer covering the inorganic layer on the outside of the inorganic layer comprises:
forming a mixture layer of an organic material and hydrophobic particles on the outside of the inorganic layer by an ink jet printing process or a spin coating process; and
subjecting the mixture layer to curing treatment, to obtain the organic layer,
wherein the organic material comprises any of a UV-curable material and a thermal-curable material.
18. A display apparatus, comprising:
a display device encapsulated by the encapsulation structure according to claim 1 .
19. The display apparatus according to claim 18 , wherein the display device is an organic light-emitting diode device or a quantum dot light-emitting diode device.