Surface treatment of carbon containing films using organic radicals

1. A method for processing a workpiece, the workpiece comprising a semiconductor material and a carbon containing layer, the method comprising performing a surface treatment process on the carbon containing layer, the surface treatment process comprising:

generating one or more species using a plasma induced in a first chamber;

filtering the one or more species generated by the plasma to create a first mixture;

injecting one or more hydrocarbon molecules into the first mixture post filtering to create a second mixture, the second mixture comprising one or more organic radicals; and

exposing the carbon containing layer to the second mixture in a second chamber

wherein the one or more species generated by the plasma to create the first mixture is filtered by a separation grid separating the first chamber from the second chamber;

wherein the separation grid comprises a first grid plate and a second grid plate, the first gird plate is configured to filter the one or more species to create the first mixture, wherein the second mixture passes through the second grid plate for exposure to the carbon containing layer, wherein the one or more hydrocarbon molecules are injected into the first mixture post filtering by a gas injection source that is located between the first grid plate and the second grid plate.

2. The method of claim 1 , wherein the one or more hydrocarbon molecules have a chemical formula of C n H 2n+2 , where n is greater than or equal to 1 and less than or equal to 10.

3. The method of claim 1 , wherein the one or more hydrocarbon molecules have a chemical formula of C n H 2n , where n is greater than or equal to 2 and n is less than or equal to 10.

4. The method of claim 1 , wherein the one or more organic radicals are generated by dissociating one or more hydrocarbon molecules in the second mixture in the first chamber.

5. The method of claim 1 , wherein the first chamber is separated from the second chamber with a separation grid, and wherein the hydrocarbon molecules are mixed with the species in the second chamber.

6. The method of claim 1 , wherein the second mixture comprises one or more organic radicals.

7. The method of claim 1 , wherein the second mixture comprises a CH 3 radical.

8. The method of claim 1 , wherein the carbon containing layer comprises photoresist.

9. The method of claim 1 , wherein the method comprises performing a dry strip process to remove at least a portion of the carbon containing layer.

10. The method of claim 1 , wherein the one or more species generated by the plasma induced in a process gas in the first chamber.

11. The method of claim 10 , wherein the process gas is an inert gas.

12. The method of claim 11 , wherein the inert gas is helium.

13. The method of claim 10 , wherein the process gas comprises a hydrogen gas and the species comprise hydrogen radicals.

14. The method of claim 10 , wherein the one or more organic radicals are generated in the plasma in the first chamber using an inductively coupled plasma source.

15. The method of claim 10 , wherein the method comprises filtering one or more ions to create the first mixture using a separation grid separating the first chamber from the second chamber.

16. The method of claim 1 , wherein the one or more species comprise hydrogen radicals generated using a heated filament.

17. The method of claim 1 , wherein the one or more organic radicals are generated using pyrolysis of molecules or UV-assisted molecule dissociation.

18. A method of processing a semiconductor workpiece, the method comprising:

performing an organic radical based surface treatment process on a workpiece to modify a surface wetting angle of a workpiece layer on the workpiece;

subsequent to performing the organic radical based surface treatment process, depositing a coating material on the workpiece layer;

wherein the organic radical based surface treatment process comprises:

generating one or more species using a plasma induced in a first chamber;

filtering the one or more species generated by the plasma to create a first mixture;

injecting one or more hydrocarbon molecules into the first mixture post filtering to create a second mixture, the second mixture comprising one or more organic radicals; and

exposing the workpiece layer to the second mixture in a second chamber

wherein the one or more species generated by the plasma to create the first mixture is filtered by a separation grid separating the first chamber from the second chamber;

wherein the separation grid comprises a first grid plate and a second grid plate, the first gird plate is configured to filter the one or more species to create the first mixture, the second mixture passes through the second grid plate for exposure to the carbon containing layer, wherein the one or more hydrocarbon molecules are injected into the first mixture post filtering by a gas injection source that is located between the first grid plate and the second grid plate.

19. The method of claim 18 , wherein the workpiece layer is a hydrophilic workpiece layer.

20. The method of claim 18 , wherein the workpiece layer comprises Si, SiGe, SiN, SiO 2 , Al 2 O, TaN, TiN, W, or Cu.

21. The method of claim 18 , wherein the coating material comprises photoresist.

22. The method of claim 18 , wherein the coating material comprises an antireflective material.

23. The method of claim 18 , wherein the one or more hydrocarbon molecules have a chemical formula of C n H 2+2 , where n is greater than or equal to 1 and less than or equal to 10 or the one or more hydrocarbon molecules have a chemical formula of C n H 2n , where n is greater than or equal to 2 and n is less than or equal to 10.

24. The method of claim 18 , wherein the one or more species are generated by inducing the plasma in a process gas in the first chamber.

25. The method of claim 24 , wherein the process gas is an inert gas.