Capacitor component and method of manufacturing the same

1. A capacitor component comprising:

a body including:

first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, and

a structure in which a plurality of dielectric layers are stacked and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween to be exposed to the third and fourth surfaces respectively;

first and second conductive layers covering the third and fourth surfaces respectively and connected to the first and second internal electrodes respectively;

first and second insulating layers, covering the first and second conductive layers respectively;

first and second band portions spaced apart from each other on the second surface;

a first external electrode covering a portion of the first band portion and a portion of the first insulating layer on the third surface;

a second external electrode covering a portion of the second band portion and a portion of the second insulating layer on the fourth surface;

a third external electrode covering another portion of the first insulating layer on the third surface and a portion of the first surface, the third external electrode being separate and spaced apart from the first external electrode; and

a fourth external electrode covering another portion of the second insulating layer on the fourth surface and another portion of the first surface, the fourth external electrode being separate and spaced apart from the second external electrode.

2. The capacitor component of claim 1 , wherein the first and second external electrodes are plating layers.

3. The capacitor component of claim 2 , wherein the plating layer includes a copper layer, a nickel layer formed on the copper layer, and a tin layer formed on the nickel layer.

4. The capacitor component of claim 1 , wherein the first and second band portions are disposed to be connected to the first and second conductive layers respectively.

5. The capacitor component of claim 1 , further comprising:

third and fourth band portions spaced apart from each other on the first surface,

wherein the third external electrode covers the third band portion, and

the fourth external electrode covers the fourth band portion.

6. The capacitor component of claim 5 , wherein the third and fourth band portions are disposed to be connected to the first and second conductive layers respectively.

7. The capacitor component of claim 5 , wherein the first to fourth external electrodes are plating layers.

8. The capacitor component of claim 1 , wherein an end of the first external electrode on the third surface is spaced apart from an end of the third external electrode on the third surface, and an end of the second external electrode on the fourth surface is spaced apart from an end of the fourth external electrode on the third surface.

9. A method of manufacturing a capacitor component comprising:

forming a body by alternately stacking a plurality of dielectric layers and first and second internal electrodes;

forming first and second band portions on an upper surface of the body to be spaced apart from each other;

forming first and second conductive layers and first and second insulating layers covering the first and second conductive layers, respectively, on opposing first and second surfaces of the body to which the first and second internal electrodes are exposed, respectively, and

forming a first external electrode covering a portion of the first band portion and a portion of the first insulating layer on the first surface of the body, forming a second external electrode covering a portion of the second band portion and a portion of the second insulating layer on the second surface of the body, forming a third external electrode covering another portion of the first insulating layer on the first surface of the body and a portion of a lower surface of the body, wherein the third external electrode is separate and spaced apart from the first external electrode, and forming a fourth external electrode to cover another portion of the second insulating layer on the second surface of the body and another portion of the lower surface of the body, wherein the fourth external electrode is separate and spaced apart from the second and third external electrodes.

10. The method of claim 9 , wherein in the forming of the first and second band portions comprises a method selected from a group consisting of stacking, printing, and deposition.

11. The method of claim 9 , wherein the first and second conductive layers are foil led by a green transfer method.

12. The method of claim 9 , wherein in the forming of the first and second conductive layers and the first and second insulating layers, a laminate of the first and second conductive layers and the first and second insulating layers is transferred to the body in a single operation.

13. The method of claim 9 , wherein the first and second external electrodes are formed by plating using the first and second band portions as seeds.

14. The method of claim 9 , further comprising, before the forming of the external electrodes, forming third and fourth band portions to be spaced apart from each other on a surface of the body opposing a surface on which the first and second band portions are formed.

15. The method of claim 14 , wherein the third external electrode is formed to cover the third band portion, and the fourth external electrode is formed to cover the fourth band portion.

16. The method of claim 15 , wherein the third and fourth external electrodes are formed by plating using the third and fourth band portions as seeds.