Stable nanocrystalline metal alloy coatings with ultra-low wear
The present invention relates to metal coatings and methods thereof. In certain embodiments, the invention relates to ultra-low wear noble metal alloys, such as for use in electrical contact coatings.
1. A coating comprising a binary alloy, wherein the binary alloy comprises a plurality of columnar grains, and wherein at least one of the plurality of columnar grains has a grain diameter of less than about 100 nm and an aspect ratio of 1:2 or greater, and wherein the binary alloy comprises a solvent and a solute, and wherein the solute is preferentially segregated at grain boundaries.
2. The coating of claim 1 , wherein the at least one of the plurality of columnar grains has a grain length greater than about 100 nm.
3. The coating of claim 1 , wherein the aspect ratio is of from about 1:5 to about 1:10.
4. The coating of claim 1 , wherein an average grain diameter of the plurality of columnar grains is less than about 100 nm and an average grain length of the plurality of columnar grains in greater than about 100 nm.
5. The coating of claim 1 , wherein the coating is a thin film.
6. The coating of claim 5 , wherein the thin film has a thickness of from about 10 nm to about 1000 nm.
7. The coating of claim 1 , wherein the binary alloy comprises one or more noble metals.
8. The coating of claim 7 , wherein the binary alloy comprises one or more selected from the group consisting of Ag, Al, Au, Ba, Be, Bi, Ca, Cd, Co, Cr, Cs, Cu, Fe, Ga, Ge, Hf, In, Ir, K, La, Li, Mg, Mn, Mo, Na, Nb, Ni, Os, Pb, Pd, Pt, Rb, Re, Rh, Ru, Sb, Sc, Sn, Sr, Ta, Tc, Th, Ti, Tl, V, W, Y, Zn, and Zr.
9. The coating of claim 8 , wherein the binary alloy comprises Pt and Au.
10. The coating of claim 1 , wherein the solvent is selected from the group consisting of Hf, La, Mo, Nb, Ni, Os, Pt, Re, Rh, Ru, Ta, Tc, Ti, V, W, Y, and Zr.
11. The coating of claim 1 , wherein the solute is selected from the group consisting of Ag, Al, Au, Ba, Be, Bi, Ca, Cd, Co, Cr, Cs, Cu, Fe, Ga, Ge, In, K, La, Li, Mg, Mn, Na, Ni, Pb, Rb, Sb, Sc, Sn, Sr, Th, Tl, Y, Zn, and Zr.
12. The coating of claim 11 , wherein the solvent comprises Pt and the solute comprises Au.
13. The coating of claim 1 , wherein the binary alloy comprises a stable, nanocrystalline structure.
14. The coating of claim 13 , wherein the binary alloy comprises Al—Pb, Al—Zn, Co—Cd, Co—Cu, Co—Pd, Cu—Ag, Cu—Bi, Cu—Pb, Cu—Y, Fe—Ag, Fe—Au, Fe—Cu, Fe—In, Fe—Mg, Hf—Mg, Hf—Sc, Hf—Ti, Ir—Ag, Ir—Au, Ir—Cu, Ir—Ni, Ir—Pd, Ir—Rh, La—Ba, La—Ca, La—Cr, La—Li, Mn—Cd, Mo—Au, Mo—Cr, Mo—Sc, Nb—Bi, Nb—Cu, Nb—Zr, Ni—Ag, Ni—Au, Ni—Cu, Ni—Pb, Ni—Sn, Ni—Tl, Os—Ag, Os—Cu, Os—Ni, Os—Pd, Os—Rh, Pd—Au, Pt—Au, Pt—Pd, Re—Cu, Re—Ni, Re—Pd, Re—Rh, Rh—Ag, Rh—Au, Rh—Co, Rh—Cu, Rh—Ni, Rh—Pd, Ru—Ag, Ru—Cu, Ru—Ni, Ru—Pd, Ru—Rh, Sc—Au, Sc—Ba, Sc—Cr, Sc—Cu, Sc—Sr, Sr—Mn, Ta—Bi, Ta—Cu, Ta—Hf, Ta—In, Ta—Zr, Tc—Cu, Tc—Ni, Tc—Pd, Th—Cr, Th—La, Th—Mo, Th—Sc, Th—Ti, Th—V, Th—Y, Ti—Ca, Ti—K, Ti—La, Ti—Mg, Ti—Sc, V—Cd, V—Cu, V—Sc, W—Au, W—Cr, W—Cu, W—Sb, W—Sc, W—Th, W—Y, Y—Ba, Y—Ca, Y—Cr, Y—Sr, Y—Tl, Y—V, Zr—Cs, Zr—K, Zr—Mg, Zr—Sc, Zr—Ti, or Zr—Y.
15. The coating of claim 1 , wherein the at least one of the plurality of columnar grains has a grain diameter of from about 0.5 nm to about 90 nm.
16. The coating of claim 1 , wherein the at least one of the plurality of columnar grains has a grain length of from about 20 nm to about 2000 nm.
17. A noble metal alloy electrical contact coating, comprising a thin film comprising an alloy of platinum and gold, the alloy comprising less than about 50 atom percent gold, and wherein the alloy comprises columnar grains with grain diameters of less than about 100 nm and grain lengths of greater than about 100 nm.
18. The coating of claim 17 , wherein grain growth is negligible up to a temperature of about 500° C. after weeks of exposure.
19. The coating of claim 17 , wherein the gold is preferentially segregated at grain boundaries.
20. The coating of claim 17 , wherein the thin film is deposited on a substrate by physical vapor deposition, chemical vapor deposition, sputter deposition, cold spray, electron beam deposition, atomic layer deposition, electroplating, or electroless plating.
21. A noble metal alloy electrical contact coating, comprising a thin film comprising an alloy of platinum and gold, the alloy comprising less than about 50 atom percent gold and wherein the gold is preferentially segregated at grain boundaries.
22. The coating of claim 21 , wherein the alloy comprises columnar grains with grain diameters of less than about 100 nm and grain lengths of greater than about 100 nm.
23. The coating of claim 21 , wherein grain growth is negligible up to a temperature of about 500° C. after weeks of exposure.
24. The coating of claim 21 , wherein the thin film is deposited on a substrate by physical vapor deposition, chemical vapor deposition, sputter deposition, cold spray, electron beam deposition, atomic layer deposition, electroplating, or electroless plating.