Chip package with sidewall metallization
A chip package and manufacturing method is disclosed. In one example, the method includes forming a carrier wafer with a plurality of trenches, each trench being at least partially covered with an electrically conductive sidewall coating. A semiconductor wafer is bonded on a front side of the carrier wafer. An electrically conductive connection structure is formed, including at least partially bridging a gap between the electrically conductive sidewall coating and an integrated circuit element of a respective one of the electronic chips. Material on a backside of the carrier wafer is removed to singularize the bonded wafers at the trenches into a plurality of semiconductor devices.
1. A manufacturing method, comprising:
forming a carrier wafer with a plurality of trenches, each trench being at least partially covered with an electrically conductive sidewall coating;
bonding a semiconductor wafer on a front side of the carrier wafer so that each of a plurality of electronic chips of the semiconductor wafer is aligned with respect to a respective one of the trenches;
forming an electrically conductive connection structure at least partially bridging a gap between the electrically conductive sidewall coating and an integrated circuit element of a respective one of the electronic chips; and
removing material on a backside of the carrier wafer to thereby singularize the bonded wafers at the trenches into a plurality of semiconductor devices.
2. The method according to claim 1 , wherein the method comprises forming the carrier wafer by
forming first auxiliary trenches and filling the first auxiliary trenches at least partially with electrically insulating material;
forming second auxiliary trenches laterally neighboured to the first auxiliary trenches and filling the second auxiliary trenches at least partially with the electrically conductive sidewall coating; and
subsequently forming the trenches between respectively two neighboured second auxiliary trenches so that two opposing sidewalls of the respective trench are at least partially covered with the electrically conductive sidewall coating.
3. The method according to claim 2 , wherein the method comprises forming the trenches extending deeper into the carrier wafer than the first auxiliary trenches and the second auxiliary trenches.
4. The method according to claim 2 , wherein the first auxiliary trenches are filled with the electrically insulating material by oxidizing exposed walls of the carrier wafer followed by deposition of further electrically insulating material.
5. The method according to claim 2 , wherein the second auxiliary trenches are partially filled with electrically insulating material by oxidizing exposed walls of the carrier wafer.
6. The method according to claim 1 , wherein the method comprises bonding the semiconductor wafer on the front side of the carrier wafer so that the integrated circuit elements are exposed on a main surface of the semiconductor wafer opposing a bonding surface of the semiconductor wafer.
7. The method according to claim 1 , wherein the method comprises forming through holes in the semiconductor wafer so that the through holes flush with the trenches.
8. The method according to claim 1 , wherein the method comprises forming the electrically conductive connection structure by seed metal deposition followed by electroless plating.
9. The method according to claim 1 , wherein the method comprises bonding the semiconductor wafer on the carrier wafer by adhesive material, in particular by electrically insulating adhesive material.
10. The method according to claim 1 , wherein the method comprises removing the material of the carrier wafer by grinding.
11. The method according to claim 1 , wherein the electrically conductive connection structure is formed to uninterruptedly electrically connect the electrically conductive sidewall coating with the integrated circuit element.
12. The method according to claim 1 , wherein a surface of each of the plurality of semiconductor devices has an area of not more than 0.3 mm×0.15 mm.
13. The method according to claim 1 , wherein the electrically conductive connection structure at least comprises a base wall section extending perpendicular to the electrically conductive sidewall coating.
14. The method according to claim 1 , wherein the electrically conductive connection structure at least comprises at least one sidewall section and at least one base wall section extending perpendicular to at least one sidewall section.
15. The method according to claim 1 , wherein each of the plurality of semiconductor devices comprises a non-encapsulated semiconductor device.
16. The method according to claim 1 , wherein the carrier wafer comprises glass.
17. The method according to claim 1 , wherein the method comprises mounting a semiconductor device of the plurality of semiconductor devices to a device carrier.
18. The method according to claim 17 , wherein the semiconductor device of the plurality of semiconductor devices is mounted on the device carrier at least partially by a portion of the electrically conductive connection structure.
19. The method according to claim 17 , wherein the device carrier comprises one of the group consisting of a printed circuit board and a leadframe.
20. The method according to claim 17 , wherein the semiconductor device of the plurality of semiconductor devices is mounted on the device carrier by a solder structure connecting the device carrier with the electrically conductive connection structure.