Multilayer ceramic capacitor and method of manufacturing the same
A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes, and external electrodes disposed on at least one surface of the body. The external electrodes each includes an electrode layer in contact with the first or second internal electrodes, an intermediate layer disposed on the electrode layer and including a first intermetallic compound, and a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound and a base resin.
1. A multilayer ceramic capacitor comprising: a body including a dielectric layer and first and second internal electrodes; and external electrodes disposed on at least one surface of the body, wherein the external electrodes each include: an electrode layer in contact with the first or second internal electrode; an intermediate layer disposed on the electrode layer and including a first intermetallic compound; and a conductive resin layer disposed on the intermediate layer and contacting only the intermediate layer, from among the electrode and intermediate layers, and including a plurality of metal particles, a second intermetallic compound fully enclosing at least one metal particle of the plurality of metal particles, and a base resin.
2. The multilayer ceramic capacitor of claim 1 , wherein the electrode layer is disposed to cover one surface of the body.
3. The multilayer ceramic capacitor of claim 1 , wherein the electrode layer is an electroless plating layer.
4. The multilayer ceramic capacitor of claim 1 , wherein the electrode layer is a sputtered layer.
5. The multilayer ceramic capacitor of claim 1 , wherein the electrode layer includes nickel (Ni) and boron (B).
6. The multilayer ceramic capacitor of claim 1 , wherein the electrode layer includes first surfaces in contact with the first or second internal electrode or body, and the intermediate layer is disposed to cover an entirety of second surfaces of the electrode layer other than the first surfaces.
7. The multilayer ceramic capacitor of claim 1 , wherein the intermediate layer is the first intermetallic compound formed in a layer form.
8. The multilayer ceramic capacitor of claim 1 , wherein the first intermetallic compound includes nickel (Ni) and tin (Sn).
9. The multilayer ceramic capacitor of claim 8 , wherein the first intermetallic compound is Ni 3 Sn 4 .
10. The multilayer ceramic capacitor of claim 1 , wherein the plurality of metal particles include at least one of silver (Ag) and copper (Cu), and
the second intermetallic compound includes at least one of Ag 3 Sn, Cu 6 Sn 5 , and Cu 3 Sn.
11. The multilayer ceramic capacitor of claim 1 , further comprising:
a first plating layer and a second plating layer disposed on the conductive resin layer.
12. The multilayer ceramic capacitor of claim 1 , wherein the body includes first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other,
the first and second internal electrodes are each spaced apart from both the third and fourth surfaces of the body and are respectively exposed to the third and fourth surfaces, and
the electrode layers are formed in portions by which the first internal electrode is spaced apart from the third surface of the body and on the third surface of the body to be connected to the first internal electrode, and in portions by which the second internal electrode is spaced apart from the fourth surface of the body and on the fourth surface of the body to be connected to the second internal electrode.
13. The multilayer ceramic capacitor of claim 12 , wherein the electrode layers extend from the third and fourth surfaces of the body to portions of the first and second surfaces of the body.
14. The multilayer ceramic capacitor of claim 1 , wherein the electrode layer is in direct contact with the first or second internal electrode.
15. An electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on a surface of the body,
wherein the external electrode includes:
an intermediate layer including a first intermetallic compound; and
a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound, and a base resin,
wherein the first intermetallic compound includes a metal contained in the second intermetallic compound, and
the second intermetallic compound is different from the first intermetallic compound and includes a metal contained in the plurality of metal particles.
16. The electronic component of claim 15 , wherein the second intermetallic compound encloses at least a portion of the plurality of metal particles.
17. The electronic component of claim 15 , further comprising an electrode layer in contact with the internal electrode, wherein the intermediate layer is disposed on the electrode layer.
18. The electronic component of claim 17 , wherein the internal electrode is exposed to the surface of the body having the external electrode disposed thereon and is spaced apart from the surface, and
the electrode layer extends into the body from the surface of the body having the external electrode disposed thereon to contact the internal electrode that is spaced apart from the surface.
19. The electronic component of claim 15 , wherein the first intermetallic compound includes nickel and tin,
the plurality of metal particles include at least one of silver (Ag) and copper (Cu), and
the second intermetallic compound includes at least one of Ag 3 Sn, Cu 6 Sn 5 , and Cu 3 Sn.
20. The electronic component of claim 15 , wherein the second intermetallic compound of the conductive resin layer includes a metal other than the metal contained in the plurality of metal particles and having a melting point lower than a curing temperature of the base resin.
21. A multilayer ceramic ca pacitor comprising: a body including a dielectric layer and first and second internal electrodes; and external electrodes disposed on at least one surface of the body, wherein each of the first and second internal electrodes is spaced apart from the at least one surface of the body, and wherein the external electrodes each include: an electrode layer extending in a portion of the body by which the first or second internal electrode is spaced apart from the at least one surface of the body to be in contact with the first or second internal electrode; an intermediate layer disposed on the electrode layer and including a first intermetallic compound; and a conductive resin layer disposed on the intermediate layer and contacting only the intermediate layer, from among the electrode and intermediate layers, and including a plurality of metal particles, a second intermetallic compound with a composition different from the first intermetallic compound and including a metal contained in the plurality of metal particles, and a base resin.
22. The multilayer ceramic capacitor of claim 21 , wherein the first intermetallic compound includes nickel (Ni) and tin (Sn).
23. The multilayer ceramic capacitor of claim 21 , wherein the plurality of metal particles include at least one of silver (Ag) and copper (Cu), and
the second intermetallic compound includes at least one of Ag 3 Sn, Cu 6 Sn 5 , and Cu 3 Sn.